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Development of sub-mm wave flip-chip interconnect
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Author: Monayakul, Sirinpa
ISBN: 3736984103 9783736984103 9783736994102 Year: 2016 Publisher: Gottingen, Germany : Cuvillier Verlag,
ISBN: 3736984103 9783736984103 9783736994102 Year: 2016 Publisher: Gottingen, Germany : Cuvillier Verlag,
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Abstract
Keywords
Gold alloys. --- Eutectic alloys. --- Flip chip technology. --- Flip chip devices --- Electronic packaging --- Alloys
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