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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers
Author: Franke, Jörg
ISBN: 1569905525 1680157272 1569905517 9781569905524 9781680157277 9781569905517 Year: 2014 Publisher: Munich, Germany ; Cincinnati, Ohio : Hanser Publishers,

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Abstract

Keywords
Interconnects (Integrated circuit technology) --- Injection molding of plastics. --- Design and construction. --- Plastics --- Integrated circuits --- Interconnections (Integrated circuit technology) --- Molding --- Connections

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