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This book provides data center designers and operators with methods by which to assess and mitigate the risks associated with utilization of optimum cooling solutions. The goal is to provide readers with sufficient knowledge to implement measures such as free air cooling or direct liquid immersion cooling properly, or combination of existing and emerging cooling technologies in data centers, base stations, and server farms. This book also: Discusses various telecommunication infrastructures, with an emphasis on data centers and base stations Covers the most commonly known energy and power management techniques, as well as emerging cooling solutions for data centers Describes the risks to the electronic equipment fitted in these installations and the methods of risk mitigation Devotes  a particular focus to an up-to-date review of the emerging cooling methods (such as free air cooling and direct liquid immersion cooling) and tools and best practices for designers, technology developers, installation operators, and owners Informs installation designers and manufacturers of the benefits and limitations of the most common existing and emerging cooling methods Optimum Cooling of Data Centers: Application of Risk  Assessment and Mitigation Techniques is an ideal book for researchers and engineers interested in design,  manufacturing, and optimum operation  of cooling solutions for telecom and other mission-critical infrastructures.

Data libraries --- Natural ventilation. --- Cooling. --- Data archives --- Data centers --- Libraries, Data --- Engineering. --- Computer software --- Buildings --- Building. --- Construction. --- Engineering, Architectural. --- Electrical engineering. --- Building Construction. --- Communications Engineering, Networks. --- Performance and Reliability. --- Reusability. --- Design and construction. --- Ventilation --- Databases --- Information storage and retrieval systems --- Datacenters --- Computer service industry --- Telecommunication. --- Operating systems (Computers). --- Building Construction and Design. --- Electric communication --- Mass communication --- Telecom --- Telecommunication industry --- Telecommunications --- Communication --- Information theory --- Telecommuting --- Computer operating systems --- Computers --- Disk operating systems --- Systems software --- Operating systems --- Buildings—Design and construction. --- Computer software—Reusability. --- Electric engineering --- Engineering --- Architectural engineering --- Construction --- Construction science --- Engineering, Architectural --- Structural design --- Structural engineering --- Architecture --- Construction industry --- Design and construction

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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry  Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Optics. Quantum optics --- Electronics and optics of solids --- Electronics --- Materials processing --- Applied physical engineering --- mechatronica --- ingenieurswetenschappen --- transistoren --- halfgeleiders --- productieprocessen --- microwaves