Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Electronic packaging

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Electronic packaging --- Microelectronics

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod

Electronic packaging. --- Electronic apparatus and appliances --- Packaging (Electronics) --- Electronics --- Thermal properties. --- Electronic packaging --- Insulation (Heat) --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Thermal properties

Choose an application

• Reference Manager
• EndNote
• RefWorks (Direct export to RefWorks)

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems.  .

Electronic apparatus and appliances -- Temperature control. --- Electronic packaging -- Materials. --- Heat sinks (Electronics). --- Microelectronic packaging. --- Microelectronic packaging --- Microelectronics --- Heat sinks (Electronics) --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Thermal properties --- Materials --- Cooling --- Thermal interface materials. --- Thermal conductivity. --- Engineering --- Engineering materials --- Industrial materials --- TIMs (Electronics) --- Energy. --- Energy efficiency. --- Thermodynamics. --- Heat engineering. --- Heat transfer. --- Mass transfer. --- Electronics. --- Microelectronics. --- Metals. --- Energy Efficiency (incl. Buildings). --- Electronics and Microelectronics, Instrumentation. --- Engineering Thermodynamics, Heat and Mass Transfer. --- Metallic Materials. --- Engineering design --- Manufacturing processes --- Electronics