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This book presents the state of the art concerning the fundamental aspects of semi-solid processing of alloys and composites, together with the industrial applications. The fundamental aspects include both the microstructure development and characterization, and the rheology of alloy slurries with special attention to both experimental determination and modeling. The industrial applications are also surveyed and particular consideration is given to recent developments in slurry formation. Foreword provided by Prof. Merton C Flemings (MIT), the father and originator of semi-solid processing.

Material Science. --- Structural Materials. --- Metallic Materials. --- Industrial and Production Engineering. --- Solid State Physics. --- Spectroscopy and Microscopy. --- Materials. --- Industrial engineering. --- Matériaux --- Génie industriel

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Microstructure, Property and Processing of Functional Ceramics describes the preparation, property and local structure microscopy of functional ceramics. It covers functional ceramic fabrication processing, grain boundary phenomena and micro-, nanoscale structures characterizations including scanning electron acoustic microscopy, scanning probe acoustic microscopy and piezoresponse force microscopy. This book is intended for advanced undergraduates, graduates and researchers in the field of materials science, microelectronics, optoelectronics and microscopy. Qingrui Yin and Binghe Zhu both are professors at the Shanghai Institute of Ceramics, Chinese Academy of Sciences; Dr. Huarong Zeng is an associate professor at the Shanghai Institute of Ceramics, Chinese Academy of Sciences.

Chemical engineering. --- Materials science. --- Metals. --- Materials Science. --- Materials Science, general. --- Industrial Chemistry/Chemical Engineering. --- Metallic Materials. --- Chemistry, Industrial --- Engineering, Chemical --- Industrial chemistry --- Engineering --- Chemistry, Technical --- Metallurgy --- Materials. --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Materials --- Metallic elements --- Chemical elements --- Ores --- Material science --- Physical sciences

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This book is composed of ten chapters. Based on systematic description of research achievements of the project of ultra-fine grain steels and their engineering applications, new theories of microstructural refinement and the newly developed technologies in production of high strength and high toughness steels are introduced. The book features the integration of materials science with engineering technology. In the scope of theories of the strengthening and toughening of ultra-fine grain steels, the theory of deformation induced ferrite transformation (DIFT) for ferrite-pearlite steels has been put forward. The phenomenon of ultra-fine grain refinement effect by the existing precipitates of nanometer size in the steel produced by using thin slab casting and rolling (TSCR) has been discovered and analyzed. The theory of deformation induced precipitation and medium temperature phase transformation control for bainitic steels has been proposed. The theory of resistance against delayed fracturing of high strength and high toughness alloy structural steels has been established. In the aspect of production technologies, some production technologies for obtaining ultra-fine grains and high strength high toughness of steels are introduced. The chemical metallurgy, solidification technique, and welding technique etc. for ultra-fine grain steels are introduced. In the aspect of engineering applications of ultra-fine grain high strength and high toughness steels, all the trial applications and commercial applications in the areas of civil constructions, automobile manufacturing and engineering machinery etc. are described. The book provides theoretical concepts and engineering application technologies for the research, production, and application of ultra-fine grain steels.

Iron -- Metallurgy. --- Iron alloys. --- Iron. --- Steel -- Metallurgy. --- Steel alloys. --- Steel. --- Materials Science --- Chemical & Materials Engineering --- Engineering & Applied Sciences --- Iron --- Steel --- Metallurgy. --- Siderurgy --- Ferroalloys --- Ferrous alloys --- Materials science. --- Structural materials. --- Metals. --- Materials Science. --- Materials Science, general. --- Structural Materials. --- Metallic Materials. --- Alloys --- Materials. --- Engineering --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Materials --- Metallic elements --- Chemical elements --- Ores --- Metallurgy --- Architectural materials --- Architecture --- Building --- Building supplies --- Buildings --- Construction materials --- Structural materials --- Material science --- Physical sciences

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.

Electronic packaging. --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Microelectronic packaging. --- Packaging --- Materials. --- Packaging (Microelectronics) --- Materials science. --- Electronics. --- Microelectronics. --- Optical materials. --- Electronic materials. --- Nanotechnology. --- Metals. --- Materials Science. --- Optical and Electronic Materials. --- Metallic Materials. --- Electronics and Microelectronics, Instrumentation. --- Advertising --- Display of merchandise --- Physical distribution of goods --- Retail trade --- Containers --- Packing for shipment --- Electronic packaging --- Microelectronics --- Electrical engineering --- Physical sciences --- Molecular technology --- Nanoscale technology --- High technology --- Engineering --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Optics --- Materials --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Metallic elements --- Chemical elements --- Ores --- Metallurgy --- Electronic materials

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As concerns with the efficient use of energy resources, and the minimization of environmental damage have come to the fore, there has been a renewed interest in the role that thermoelectric devices could play in generating electricity from waste heat, enabling cooling via refrigerators with no moving parts, and many other more specialized applications. The main problem in realizing this ambition is the rather low efficiency of such devices for general applications. This book deals with the proceedings of a workshop addressed that problems by reviewing the latest experimental and theoretical work on suitable materials for device applications and by exploring various strategies that might increase their efficiency. The proceedings cover a broad range of approaches, from the experimental work of fabricating new compounds through to theoretical work in characterizing and understanding their properties. The effects of strong electron correlation, disorder, the proximity to metal-insulator transitions, the properties of layered composite materials, and the introduction of voids or cages into the structure to reduce the lattice thermal conductivity are all explored as ways of enhancing the efficiency of their use in thermoelectric devices.

Thermoelectric apparatus and appliances -- Materials -- Congresses. --- Thermoelectric materials -- Congresses. --- Thermoelectric apparatus and appliances --- Thermoelectric materials --- Peltier heat --- Thermoelements --- Materials science. --- Inorganic chemistry. --- Condensed matter. --- Thermodynamics. --- Heat engineering. --- Heat transfer. --- Mass transfer. --- Metals. --- Materials Science. --- Materials Science, general. --- Condensed Matter Physics. --- Inorganic Chemistry. --- Engineering Thermodynamics, Heat and Mass Transfer. --- Metallic Materials. --- Electrical engineering --- Semiconductors --- Thermoelectricity --- Direct energy conversion --- Electronic apparatus and appliances --- Materials --- Materials. --- Chemistry, inorganic. --- Engineering. --- Construction --- Industrial arts --- Technology --- Inorganic chemistry --- Chemistry --- Inorganic compounds --- Engineering --- Engineering materials --- Industrial materials --- Engineering design --- Manufacturing processes --- Metallic elements --- Chemical elements --- Ores --- Metallurgy --- Mass transport (Physics) --- Thermodynamics --- Transport theory --- Heat transfer --- Thermal transfer --- Transmission of heat --- Energy transfer --- Heat --- Mechanical engineering --- Chemistry, Physical and theoretical --- Dynamics --- Mechanics --- Physics --- Heat-engines --- Quantum theory --- Condensed materials --- Condensed media --- Condensed phase --- Materials, Condensed --- Media, Condensed --- Phase, Condensed --- Liquids --- Matter --- Solids --- Material science --- Physical sciences --- Electricity --- Solar batteries