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Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.

Engineering. --- Electronics and Microelectronics, Instrumentation. --- Optical and Electronic Materials. --- Surfaces and Interfaces, Thin Films. --- Engineering, general. --- Electronics. --- Optical materials. --- Surfaces (Physics). --- Ingénierie --- Electronique --- Matériaux optiques --- Surfaces (Physique) --- Integrated circuits -- Wafer-scale integration. --- Integrated circuits. --- Technology. --- Electrical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Digital integrated circuits. --- Integrated circuits --- Wafer-scale integration. --- Wafer-scale integration of circuits --- WSI circuits --- Microelectronics. --- Electronic materials. --- Materials --- Thin films. --- Surfaces. --- Digital electronics --- Construction --- Industrial arts --- Technology --- Physics --- Surface chemistry --- Surfaces (Technology) --- Optics --- Electrical engineering --- Physical sciences --- Materials—Surfaces. --- Films, Thin --- Solid film --- Solid state electronics --- Solids --- Coatings --- Thick films --- Electronic materials --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Surface phenomena --- Friction --- Surfaces (Physics) --- Tribology --- Surfaces