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Book
ISBN: 1523127783 3035733244 9783035733242 9783035713244 Year: 2018 Publisher: Zurich, Switzerland : Scientific.Net,
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Periodical
ISSN: 15558037 Year: 2004 Publisher: Washington, DC : International Microelectronics and Packaging Society,
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Microelectronics --- Electronic packaging --- Microelectronic packaging
Book
ISBN: 1523117427 1608076989 9781608076987 1608076970 9781608076970 9781523117420 9781608076970 Year: 2014 Publisher: Boston [Massachusetts] London [England]
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Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --
Microelectronic packaging. --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics
Book
ISSN: 16629809 ISBN: 9783038134800 3038134805 9780878492138 0878492135 1613446713 Year: 2011 Volume: v. 460/461 Publisher: Stafa-Zurich, Switzerland ; Enfield, N.H. : Trans Tech Publications,
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The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology. This work thus constitutes a handy guide to current thinking in the field. Review from Book News Inc.: Nearly 150 selected an
Book
ISBN: 9783038263944 303826394X 9783038350132 Year: 2014 Publisher: [Zurich], Switzerland
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Collection of selected, peer reviewed papers from the 2013 3rd International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia. The 42 papers are grouped as follows: Chapter 1: Materials Science and Materials Processing Technology; Chapter 2: Mechanics; Chapter 3: Modelling, Design and Manufacturing; Chapter 4: Automation, Control, Information Technology and MEMS
Book
ISBN: 9780081023921 0081023928 9780081023914 008102391X Year: 2019 Publisher: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier,
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Electronic packaging. --- Packaging (Electronics) --- Electronic apparatus and appliances --- Electronics
Periodical
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Electric connectors --- Electric contacts --- Electronic circuits --- Electronic packaging
Book
ISBN: 1283971712 9814313793 9789814313797 9781283971713 9814313785 9789814313780 9789814313803 9789814313810 9789814313827 9789814313834 9789814327619 9789814327626 Year: 2013 Publisher: Singapore World Scientific
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Please click here for information on Set 2: Thermal Packaging ToolsThermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic prod
Electronic packaging. --- Electronic apparatus and appliances --- Packaging (Electronics) --- Electronics --- Thermal properties. --- Electronic packaging --- Insulation (Heat) --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Thermal properties
ISBN: 1280816333 9786610816330 0387461159 0387366423 Year: 2007 Publisher: New York : Springer,
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Physical Design Essentials explains the basic steps required in the physical design of Application Specific Integrated Circuits (ASICs). The subject matter presentation follows the industry-common ASIC physical design flow. Topics covered include: Basic standard cell design, transistor-sizing, and layout styles Linear, non-linear, and polynomial characterization Physical design constraints and floor planning styles Algorithms used for placement Clock tree synthesis Algorithms used for global and detailed routing Parasitic extraction Functional timing and physical methods of verification Testing Techniques Physical Design Essentials is written for professional design engineers who need to be conversant with all aspects of ASIC design implementation: device processes, library development, place-and-route algorithms, verification, and testing.
ISBN: 030904233X 9786610212514 1280212519 0309536693 0585143951 9780585143958 9780309042338 Year: 1990 Publisher: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
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Electronic packaging --- Electrical engineering --- Materials. --- Packaging (Electronics) --- Electronic apparatus and appliances --- Electronics
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