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This book elucidates the reasons underlying the lasting success of DNQ/N resist systems by examining the correlation between the chemical structure of the components and the photoresist performance. The basic chemistry of both DNQ sensitizers and novolak resins are explored. Focus also is placed on the chemical basis of application-related facets of the lithographic process. Methods of increasing process performance, such as image reversal, top layer imaging, antireflection layers, and phase shift technology are treated.

Photoresists. --- Masks (Electronics)