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This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

Solder and soldering.

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Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. . Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution. Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB). Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD). Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Solder and soldering. --- Failure analysis (Engineering)

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Welding --- Solder and soldering --- Soudage --- Soudure --- Periodicals --- Périodiques --- Périodiques --- Materials processing

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Brazing processes offer enhanced control, adaptability and cost-efficiency in the joining of materials. Unsurprisingly, this has lead to great interest and investment in the area. Drawing on important research in the field, Advances in brazing provides a clear guide to the principles, materials, methods and key applications of brazing.Part one introduces the fundamentals of brazing, including molten metal wetting processes, strength and margins of safety of brazed joints, and modeling of associated physical phenomena. Part two goes on to consider specific materials, such as super alloy

Brazing --- Welding --- Technological innovations. --- Forging --- Manufacturing processes --- Metal-work --- Sealing (Technology) --- Solder and soldering

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Welding. --- Brazing. --- Solder and soldering. --- Soudage. --- Brasage. --- Produit d'apport (brasage)