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Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]

encapsulation --- n/a --- NEM memory switch --- magnetotransistor --- gas sensor --- nano-system array --- metal oxide (MOX) sensor --- capacitive pressure sensor --- real-time temperature compensation loop --- mechanical relays --- single-crystal silicon (SC-Si) --- MEMS relays --- MEMS --- oscillator --- micro-electro-mechanical system (MEMS) --- uncooled IR-bolometer --- microelectromechanical systems --- microbolometer --- programmable sustaining amplifier --- micro sensor --- CMOS-MEMS --- pierce oscillator --- MEMS resonators --- micro/nanoelectromechanical systems (MEMS/NEMS) --- resonator --- microhotplate --- NEMS --- application-specific integrated circuit (ASIC) --- MEMS modelling --- magnetic field --- chopper instrumentation amplifier --- microresonators --- interface circuit --- Hall effect --- thermal detector --- temperature sensor --- infrared sensor --- CMOS–NEMS --- CMOS --- atomic force microscope --- MEMS switches --- stent --- micro-electro-mechanical systems (MEMS) sensors --- nano resonator --- silicon-on-insulator (SOI) --- MEMS-ASIC integration --- Sigma-Delta --- MEMS characterization --- high-Q capacitive accelerometer --- mass sensors --- M3D --- CMOS-NEMS

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Application-specific integrated circuits. --- Circuits intégrés à la demande --- Application specific integrated circuits --- 621.3.049.77 --- 621.382vl --- ASIC application specified IC --- FPGA field programmable gate arrays --- IC integrated circuits --- PLD programmable logic design --- VHDL very high speed hardware description language --- VLSI very large scale integration --- floorplanning --- logisch ontwerpen --- logische synthese --- ontwerpen --- routing --- verilog --- Microelectronics. Integrated circuits --- Application specific integrated circuits. --- 621.3.049.77 Microelectronics. Integrated circuits --- Circuits intégrés à la demande --- ASICs (Integrated circuits) --- Integrated circuits --- Circuits intégrés à la demande. --- Circuits intégrés à la demande.

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Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.

micromachining --- n/a --- turbulent kinetic energy dissipation rate --- microelectromechanical systems (MEMS) piezoresistive sensor chip --- WiFi-RSSI radio map --- step detection --- built-in self-test --- regularity of activity --- motion analysis --- gait analysis --- frequency --- acceleration --- MEMS accelerometer --- zero-velocity update --- rehabilitation assessment --- vacuum microelectronic --- dance classification --- Kerr noise --- MEMS --- micro machining --- MEMS sensors --- stereo visual-inertial odometry --- self-coaching --- miniaturization --- wavelet packet --- three-axis acceleration sensor --- MEMS-IMU accelerometer --- performance characterization --- electrostatic stiffness --- delaying mechanism --- three-axis accelerometer --- angular-rate sensing --- indoor positioning --- whispering-gallery-mode --- sensitivity --- heat convection --- multi-axis sensing --- L-shaped beam --- stride length estimation --- activity monitoring --- process optimization --- mismatch of parasitic capacitance --- electromechanical delta-sigma --- cathode tips array --- in situ self-testing --- high acceleration sensor --- deep learning --- marine environmental monitoring --- accelerometer --- fault tolerant --- hostile environment --- micro-electro-mechanical systems (MEMS) --- low-temperature co-fired ceramic (LTCC) --- classification of horse gaits --- Taguchi method --- interface ASIC --- capacitive transduction --- digital resonator --- safety and arming system --- inertial sensors --- MEMS technology --- sleep time duration detection --- field emission --- probe --- piezoresistive effect --- capacitive accelerometer --- auto-encoder --- MEMS-IMU --- body sensor network --- optical microresonator --- wireless --- hybrid integrated --- mode splitting

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The aim of this Special Issue is to explore new advanced solutions in electronic systems and interfaces to be employed in sensors, describing best practices, implementations, and applications. The selected papers in particular concern photomultiplier tubes (PMTs) and silicon photomultipliers (SiPMs) interfaces and applications, techniques for monitoring radiation levels, electronics for biomedical applications, design and applications of time-to-digital converters, interfaces for image sensors, and general-purpose theory and topologies for electronic interfaces.

Technology: general issues --- CMOS image sensor --- linearity --- adaptive nonlinear ramp --- fully differential pipeline --- double auto-zeroing --- high framerate --- fixed pattern noise --- floating diffusion --- readout scheme --- ramp generator circuit --- ultrasound --- PMUT --- high-voltage (HV) transmitter --- low-voltage receiver (RX) amplifier --- ultrasound application-specific integrated circuit (ASIC) --- monolithical integration --- CMOS --- MEMS --- electrical impedance spectroscopy (EIS) --- time-to-digital converter (TDC) --- time interpolator --- phase --- polar demodulator --- quantization --- reconfigurability --- current mode --- sensor interface --- silicon photomultiplier --- transimpedance amplifier --- voltage current conveyor --- field-programmable gate arrays (FPGA) --- non-uniform multiphase (NUMP) method --- temperature correction --- radiation sensor interface --- silicon photomultiplier (SiPM) --- mobile dosimeter --- analog-to-digital converter (ADC) --- magnetic bioreactor --- magnetoactive scaffolds --- tissue engineering --- magnetic actuator --- magnetoelectric stimulation --- selectable gain amplifier --- resistive-sensor --- current divider --- current reference --- front-end electronics --- single-photon response --- timing accuracy --- ultrasonic gas flowmeter --- the principle of time-difference method --- data filtering --- low-power measurement --- auto-balancing bridge method --- FIR filter --- FPGA --- impedance --- inductive-loop sensor --- multifrequency --- vehicle magnetic profile --- vector voltmeter --- signal processing --- background radiation monitoring system --- Atmel AVR ATmega328 microcontroller (MC) --- Geiger-Mueller counter --- Petri net model --- fifth-order low-pass filter --- operational transconductance amplifier --- multiple-input bulk-driven technique --- subthreshold region --- nanopower --- temperature compensation --- hysteresis --- quartz flexible accelerometer --- aerial inertial navigation system --- thermal effect --- creep effect --- electronic nose --- convolutional neural network --- component analysis --- xenon TPC --- trigger concepts --- data acquisition circuits --- n/a