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Book
Critical Heat Flux in Flow Boiling in Microchannels
Authors: ---
ISBN: 9783319177359 3319177346 9783319177342 3319177354 Year: 2015 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,” by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.


Book
Heat Transfer and Pressure Drop in Flow Boiling in Microchannels
Authors: ---
ISBN: 3319202847 3319202855 Year: 2016 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.


Book
Instability in Flow Boiling in Microchannels
Authors: ---
ISBN: 3319234307 3319234315 Year: 2016 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Microchannels,” and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.


Book
Advances in Heat Transfer Enhancement
Authors: --- --- ---
ISBN: 3319294784 3319294806 Year: 2016 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.


Book
Introduction to enhanced heat transfer
Authors: --- --- ---
ISBN: 3030207390 3030207404 3030207420 9783030207397 Year: 2020 Publisher: Cham, Switzerland : Springer,

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This Brief stands as a primer for heat transfer fundamentals in heat transfer enhancement devices, the definition of heat transfer area, passive and active enhancement techniques and their potential and benefits and commercial applications. It further examines techniques and modes of heat transfer like single-phase flow and two-phase flow, natural and forced convection, radiation heat transfer and convective mass transfer.


Book
Insert Devices and Integral Roughness in Heat Transfer Enhancement
Authors: --- --- ---
ISBN: 3030207765 3030207757 Year: 2020 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices. .


Book
Performance Evaluation Criteria in Heat Transfer Enhancement
Authors: --- --- ---
ISBN: 3030207587 3030207609 3030207579 Year: 2020 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief deals with Performance Evaluation Criteria (PEC) for heat exchangers, single phase flow, objective function and constraints, algebraic formulation, constant flow rate, fixed flow area, thermal resistance, heat exchanger effectiveness, relations for St and f, finned tube banks, variations of PEC, reduced exchanger flow rate, exergy based PEC, PEC for two-phase heat exchangers, work consuming, work producing and heat actuated systems. The authors explain Performance Criteria of Enhanced Heat Transfer Surfaces—the ratio of enhanced performance to the basic performance—and its importance for Heat Transfer Enhancement and efficient thermal management in devices.


Book
Heat Transfer Enhancement in Plate and Fin Extended Surfaces
Authors: --- --- ---
ISBN: 3030207366 3030207382 3030207358 Year: 2020 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.


Book
Two-Phase Heat Transfer Enhancement
Authors: --- --- ---
ISBN: 3030207552 3030207544 Year: 2020 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief concerns heat transfer and pressure drop in heat transfer enhancement for boiling and condensation. The authors divide their topic into six areas: abrasive treatment and coatings, combined structured and porous surfaces, basic principles of boiling mechanism, vapor space condensation, convective vaporization, and forced condensation inside tubes. Within this framework, the book examines range of specific phenomena including abrasive treatment, open grooves, 3D cavities, etched surfaces, electroplating, pierced 3D cover sheets, attached wire and screen promoters, non-wetting coatings, oxide and ceramic coatings, porous surfaces, structured surfaces (integral roughness), combined structured and porous surfaces, composite surfaces, single-tube pool boiling tests, theoretical fundamentals like liquid superheat, effect of cavity shape and contact angle on superheat, entrapment of vapor in cavities, nucleation at a surface cavity, effect of dissolved gases, bubble departure diameter, bubble dynamics, boiling hysteresis and orientation effects, basic principles of boiling mechanism, visualization and mechanism of boiling in subsurface tunnels, and Chien and Webb parametric boiling studies. .


Book
Electric Fields, Additives and Simultaneous Heat and Mass Transfer in Heat Transfer Enhancement
Authors: --- --- ---
ISBN: 3030207722 3030207730 Year: 2020 Publisher: Cham : Springer International Publishing : Imprint: Springer,

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This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.

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