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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
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With vastly increased complexity and functionality in the ""nanometer era"" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing e
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
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With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
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Power Distribution Networks with On-Chip Decoupling Capacitors is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding tens of watts and the power supply below a volt. The book provides insight and intuition into the behavior and design of integrated circuit-based power distribution systems. The book has three primary objectives. The first is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the power terminals of the on-chip circuitry. The second is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for effciently placing on-chip decoupling capacitors in nanoscale integrated circuits. Power Distribution Networks with On-Chip Decoupling Capacitors is a reference for professional engineers in the fields of circuits and systems and computer-aided design.
Technology -- variable capacitors. --- Variable capacitors. --- Very high speed integrated circuits -- Power supply. --- Variable capacitors --- Very high speed integrated circuits --- Electrical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Power supply --- Power supply. --- VHSIC --- Integrated circuits --- Capacitors --- Very large scale integration --- Production of electric energy or. --- Systems engineering. --- Electronics. --- Computer aided design. --- Computer engineering. --- Power Electronics, Electrical Machines and Networks. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Electrical Engineering. --- Computers --- CAD (Computer-aided design) --- Computer-assisted design --- Computer-aided engineering --- Design --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Power electronics. --- Electronic circuits. --- Microelectronics. --- Computer-aided engineering. --- Electrical engineering. --- Electric engineering --- CAE --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics, Power --- Electric power --- Data processing
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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Electrical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electric circuits. --- Circuits, Electric --- Electric lines --- Systems engineering. --- Electronics. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Electronic circuits. --- Microelectronics. --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Variable capacitors --- Very high speed integrated circuits --- VHSIC --- Integrated circuits --- Capacitors --- Power supply --- Very large scale integration --- NETWORKS ON A CHIP, NOC (MIKROELEKTRONIK) --- SYSTEM ON A CHIP, SOC (MIKROELEKTRONIK) --- SCHALTKREISENTWURF (MIKROELEKTRONIK) --- LEISTUNG (COMPUTERSYSTEME) --- FACHLICHE NACHSCHLAGEWERKE + FACHLEXIKA + HANDBÜCHER (DOKUMENTENTYP) --- NETWORKS ON A CHIP, NOC (MICROELECTRONICS) --- NETWORKS ON A CHIP, NOC (MICROÉLECTRONIQUE) --- SYSTEM ON A CHIP, SOC (MICROÉLECTRONIQUE) --- SYSTEM ON A CHIP, SOC (MICROELECTRONICS) --- DESSIN DES CIRCUITS IMPRIMÉS (MICROÉLECTRONIQUE) --- CIRCUIT DESIGN (MICROELECTRONICS) --- PERFORMANCE (COMPUTER SYSTEMS) --- PERFORMANCE (SYSTÈMES INFORMATIQUES) --- OUVRAGES DE RÉFÉRENCE SPÉCIALISÉS + ENCYCLOPÉDIES SPÉCIALISÉES + MANUELS (TYPE DE DOCUMENT) --- SPECIALIZED REFERENCE WORKS + SPECIALIZED ENCYCLOPAEDIAS + HANDBOOKS (DOCUMENT TYPE)
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