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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction. --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits

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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

Radio frequency integrated circuits. --- Three-dimensional integrated circuits --- Materials. --- RFICs (Integrated circuits) --- Integrated circuits --- Radio circuits --- 3D ICs (Three-dimensional integrated circuits) --- Silicon --- Electric properties.

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Interconnects (Integrated circuit technology) --- Systems on a chip. --- Three-dimensional integrated circuits. --- SOC design --- Systems on chip --- Embedded computer systems --- Integrated circuits --- Interconnections (Integrated circuit technology) --- 3D ICs (Three-dimensional integrated circuits) --- Connections

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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Circuits and systems. --- Electronics. --- Engineering. --- Three-dimensional integrated circuits -- Design. --- Three-dimensional integrated circuits --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits. --- Integrated circuits. --- Chips (Electronics) --- Circuits, Integrated --- Computer chips --- Microchips --- 3D ICs (Three-dimensional integrated circuits) --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Circuits and Systems. --- Processor Architectures. --- Electronics and Microelectronics, Instrumentation. --- Electronic circuits --- Microelectronics --- Integrated circuits --- Systems engineering. --- Computer science. --- Electrical engineering --- Physical sciences --- Informatics --- Science --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Minicomputers --- Electron-tube circuits --- Electric circuits --- Electron tubes

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering. ·Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region; ·Enables readers to use a model which is technology dependent and can be used for any TSV configuration; ·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors; ·Equips readers for fast parasitic extraction of TSVs for 3D IC design.

Engineering. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Processor Architectures. --- Computer science. --- Electronics. --- Systems engineering. --- Ingénierie --- Informatique --- Electronique --- Ingénierie des systèmes --- Embedded computer systems. --- Integrated circuits -- Design and construction. --- Three-dimensional integrated circuits. --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Three-dimensional integrated circuits --- Mathematical models. --- 3D ICs (Three-dimensional integrated circuits) --- Microprocessors. --- Microelectronics. --- Electronic circuits. --- Integrated circuits --- Informatics --- Science --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Minicomputers --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes