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219 8. 2 Sensors 221 8. 3 Physical Sensors 222 8. 3. 1 Electrical Sensing Means 223 8. 3. 2 Magnetic Field Methods 231 8. 3. 3 Optical Methods 232 8. 4 Chemical Sensors 241 8. 4. 1 Electrical Gas and Chemical Sensors 243 8. 4. 2 Guided-Optics Intrinsic Chemical Sensors 246 8. 4. 3 Extrinsic Chemical Sensors 250 8. 4. 4 Polymer Waveguide Chemical Sensors 251 8. 4. 5 Surface Plasmon Chemical Sensors 252 8. 4. 6 Indicator-Mediated Extrinsic Sensing 253 8. 4. 7 Optical Biosensors 256 8. 4. 8 Ultrasonic Gas and Chemical Sensors 257 8. 4. 9 Intelligent Sensors 258 8. 5 Connections/Links and Wiring 258 8. 5. 1 Optical Links 260 8. 5. 2 Requirement on the Processing Unit/Intelligence 262 8. 6 Actuators 263 8. 7 Signal Processing/Computing 264 8. 7. 1 Implicit Computation 266 8. 7. 2 Explicit Computation 267 8. 8 References 274 Subject Index 279 Micro-Actuators (Electrical, Magnetic, Thermal, Optical, Mechanical, and Chemical) It has become quite apparent that sensors and actuators are the main bottleneck of the modem information processing and control systems. Microprocessors and computers used to be the main limiting element in most information processing systems. But thanks to the enonnous progress in the microelectronics industry, most information analysis tasks can be processed in real time. The data has to be acquired by the processor in some form and processed and used to produce some useful function in the real world.

Microactuators --- 681 --- 681.58-181.48 --- #BIBC:T1998 --- Actuators --- Microelectromechanical systems --- 681 Precision mechanisms and instruments --- Precision mechanisms and instruments --- Microsysteemtechnologie --- Electrical engineering. --- Materials science. --- Mechanical engineering. --- Electrical Engineering. --- Characterization and Evaluation of Materials. --- Mechanical Engineering. --- Engineering, Mechanical --- Engineering --- Machinery --- Steam engineering --- Material science --- Physical sciences --- Electric engineering --- Microactuators. --- Microactionneurs --- Actionneurs

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MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Microelectronic packaging --- Congresses --- Mechanical Engineering --- Engineering & Applied Sciences --- Mechanical Engineering - General --- Electrical & Computer Engineering --- Electrical Engineering --- Manufactures. --- Metals. --- Optical materials. --- Electronic materials. --- Materials science. --- Electrical engineering. --- Manufacturing, Machines, Tools, Processes. --- Metallic Materials. --- Optical and Electronic Materials. --- Characterization and Evaluation of Materials. --- Electrical Engineering. --- Electric engineering --- Engineering --- Material science --- Physical sciences --- Electronic materials --- Optics --- Materials --- Metallic elements --- Chemical elements --- Ores --- Metallurgy --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Microelectronic packaging - Congresses --- Adhesive bonding --- Electronic packages --- Films --- Microelectronics --- Soldering

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The fluorine atom, by virtue of its electronegativity, size, and bond strength with carbon, can be used to create compounds with remarkable properties. Small molecules containing fluorine have many positive impacts on everyday life of which blood substitutes, pharmaceuticals, and surface modifiers are only a few examples. Fluoropolymers, too, while traditionally associated with extreme high performance applications have found their way into our homes, our clothing, and even our language. A recent American president was often likened to the tribology of PTFE. Since the serendipitous discovery of Teflon at the DuPont Jackson Laboratory in 1938, fluoropolymers have grown steadily in technological and marketplace importance. New synthetic fluorine chemistry, new processes, and new apprecia tion of the mechanisms by which fluorine imparts exceptional properties all contribute to accelerating growth in fluoropolymers. There are many stories of harrowing close calls in the fluorine chemistry lab, especially from the early years, and synthetic challenges at times remain daunting. But, fortunately, modem techniques and facilities have enabled significant strides toward taming both the hazards and synthetic uncertainties, In contrast to past environmental problems associated with fluorocarbon refrigerants, the exceptional properties of fluorine in polymers have great environmental value. Some fluoropolymers are enabling green technologies such as hydrogen fuel cells for automobiles and oxygen selective membranes for cleaner diesel combustion.

Fluoropolymers. --- Chemistry. --- Physical chemistry. --- Polymers. --- Chemical engineering. --- Materials science. --- Industrial Chemistry/Chemical Engineering. --- Materials Science, general. --- Polymer Sciences. --- Characterization and Evaluation of Materials. --- Physical Chemistry. --- Fluoropolymers --- Materials. --- Surfaces (Physics). --- Chemistry, Physical organic. --- Polymers  . --- Chemistry, Theoretical --- Physical chemistry --- Theoretical chemistry --- Chemistry --- Polymere --- Polymeride --- Polymers and polymerization --- Macromolecules --- Material science --- Physical sciences --- Chemistry, Industrial --- Engineering, Chemical --- Industrial chemistry --- Engineering --- Chemistry, Technical --- Metallurgy --- Fluorinated polymers --- Fluorine plastics --- Fluorocarbon polymers --- Fluoroplastics --- Organofluorine compounds --- Polymers

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Catalysis --- Decarboxylation --- 577.15 --- 577.15 Enzymes. Catalysts of biological reactions. Enzymology --- Enzymes. Catalysts of biological reactions. Enzymology --- Enzymology. --- Biochemistry. --- Materials science. --- Organic chemistry. --- Physical chemistry. --- Chemistry, Physical and theoretical. --- Biochemistry, general. --- Characterization and Evaluation of Materials. --- Organic Chemistry. --- Physical Chemistry. --- Theoretical and Computational Chemistry. --- Chemistry, Theoretical --- Physical chemistry --- Theoretical chemistry --- Chemistry --- Organic chemistry --- Material science --- Physical sciences --- Biological chemistry --- Chemical composition of organisms --- Organisms --- Physiological chemistry --- Biology --- Medical sciences --- Biochemistry --- Enzymes --- Composition

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This book presents for the first time comprehensively the Theory of Alfred Puck on failure in Fiber Polymer Laminates. After a brief introduction into the failure analysis of laminates and its history, the text focuses first on Puck’s fracture criteria and gives detailed information on their physical background, mathematical derivation and application. Another core part of Puck’s Theory is his concept for Post Failure Analysis. Here, too, the physical background and the analytical procedure are presented. The theoretical chapters are completed by the presentation of the latest developments, namely the consideration of residual stresses and probabilistic effects. The second main part of the book deals with the extensive experimental verification program which has been accomplished since the mid 1990’s. As a result of this work, the Puck Theory can be regarded as better verified than any other theory. All experimental set ups and the major results are presented and explained. The book is meant for all readers who are interested in the design and analysis of composite structures, including engineering students, scientists and composite designers in industry.

Fiber-reinforced plastics --- Polymeric composites --- Fracture. --- Puck, Alfred. --- Composite polymeric materials --- Polymer-matrix composites --- Reinforced plastics --- Fibrous composites --- Surfaces (Physics). --- Mechanics. --- Mechanics, Applied. --- Engineering design. --- Ceramics, Glass, Composites, Natural Materials. --- Characterization and Evaluation of Materials. --- Solid Mechanics. --- Engineering Design. --- Design, Engineering --- Engineering --- Industrial design --- Strains and stresses --- Applied mechanics --- Engineering, Mechanical --- Engineering mathematics --- Classical mechanics --- Newtonian mechanics --- Physics --- Dynamics --- Quantum theory --- Surface chemistry --- Surfaces (Technology) --- Design --- Ceramics. --- Glass. --- Composites (Materials). --- Composite materials. --- Materials science. --- Material science --- Physical sciences --- Amorphous substances --- Ceramics --- Glazing --- Ceramic technology --- Industrial ceramics --- Keramics --- Building materials --- Chemistry, Technical --- Clay --- Composites (Materials) --- Multiphase materials --- Reinforced solids --- Solids, Reinforced --- Two phase materials --- Materials --- Fiber-reinforced plastics - Fracture --- Polymeric composites - Fracture --- Puck, Alfred