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This book provides complete step-by-step guidance on the physical implementation of modern integrated circuits, showing you their limitations and guiding you through their common remedies. The book describes today's manufacturing techniques and how they impact design rules. You will understand how to build common high frequency devices such as inductors, capacitors and T-coils, and will also learn strategies for dealing with high-speed routing both on package level and on-chip applications. Numerous algorithms implemented in Python are provided to guide you through how extraction, netlist comparison and design rule checkers can be built. The book also helps you unravel complexities that effect circuit design, including signal integrity, matching, IR drop, parasitic impedance and more, saving you time in addressing these effects directly. You will also find detailed descriptions of software tools used to analyze a layout database, showing you how devices can be recognized and connectivity accurately assessed. The book removes much of fog that often hides the inner workings of layout related software tools and helps you better understand: the physics of advanced nodes, high speed techniques used in modern integrated technologies, and the inner working of software used to analyze layout databases. This is an excellent resource for circuit designers implementing a schematic in a layout database, especially those involved in deep submicron designs, as well as layout designers wishing to deepen their understanding of modern layout rules.

Integrated circuit layout. --- Integrated Circuits --- Technology & Engineering

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Aiming at the core of the problem, Reuse Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the first two for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. Reuse Based Methodologies and Tools in the Design of Analog and Mixed-Signal Integrated Circuits features a very detailed, tutorial, and in-depth coverage of all issues and must-have properties of reusable AMS blocks, as well as a thorough description of the methods and tools necessary to implement them. For the first time, this has been done hierarchically, covering one by one the different stages of the design flow, allowing us to examine how the reusable block yields its benefits, both in design time and correct performance.

Integrated circuit layout. --- Integrated circuits. --- Chips (Electronics) --- Circuits, Integrated --- Computer chips --- Microchips --- Electronic circuits --- Microelectronics --- Layout, Integrated circuit --- Integrated circuits --- Design and construction --- Systems engineering. --- Computer aided design. --- Computer engineering. --- Electronics. --- Circuits and Systems. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Electrical Engineering. --- Electronics and Microelectronics, Instrumentation. --- Electrical engineering --- Physical sciences --- Computers --- CAD (Computer-aided design) --- Computer-assisted design --- Computer-aided engineering --- Design --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Electronic circuits. --- Computer-aided engineering. --- Electrical engineering. --- Microelectronics. --- CAE --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electric engineering --- Data processing --- Integrated circuit layout

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Analog Layout Synthesis: A Survey of Topological Approaches Edited by: Helmut E. Graeb Analog components appear on 75% of all chips, and cause 40% of the design effort and 50% of the re-designs. Due to increasing functional complexity of systems-on-chip, the difficulties in analog design and the lack of design automation support for analog circuits make analog components a bottleneck in chip design. Design methodology and design automation for analog circuits therefore is a crucial problem for developing systems-on-chip and layout synthesis is a key part of the analog design flow. Layout design is the step of the analog design flow with the least support by commercially available, computer-aided design tools. This book provides a survey of promising new approaches to automated, analog layout design, which have been described recently and are rapidly being adopted in industry. •Presents a comprehensive survey of promising new methods for automated, analog layout design; •Covers a variety recent of approaches to topological placement of analog circuits; •Provides a comprehensive overview of routing issues and techniques for analog circuits; •Provides a complete view of analog layout in the design flow, including retargeting an existing layout for a new technology, integrating layout in the sizing process, and constraint management; •Represents a one-of-a-kind, single-source reference to the latest advances in analog layout synthesis.

Integrated circuit layout. --- Linear integrated circuits -- Design. --- Linear integrated circuits --- Electrical & Computer Engineering --- Electrical Engineering --- Engineering & Applied Sciences --- Design --- Design. --- Linear ICs --- Engineering. --- Computer-aided engineering. --- Electronic circuits. --- Circuits and Systems. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Analog integrated circuits --- Systems engineering. --- Computer aided design. --- CAD (Computer-aided design) --- Computer-assisted design --- Computer-aided engineering --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- CAE --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Data processing

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Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.

Microelectronic packaging. --- Packaging -- Materials. --- Electrical & Computer Engineering --- Art, Architecture & Applied Arts --- Engineering & Applied Sciences --- Electrical Engineering --- Architecture --- Integrated circuit layout. --- Integrated circuits --- Layout, Integrated circuit --- Design and construction. --- Architecture. --- Construction. --- Electronic circuits. --- Architecture / Design. --- Basics of Construction. --- Circuits and Systems. --- Design and construction --- Systems engineering. --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Architecture, Western (Western countries) --- Building design --- Buildings --- Construction --- Western architecture (Western countries) --- Art --- Building --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Building. --- Engineering. --- Industrial arts --- Technology --- Architectural engineering --- Construction science --- Engineering, Architectural --- Structural design --- Structural engineering --- Construction industry --- Architecture, Primitive

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The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. This book aims to highlight advances in all aspects of CMOS integrated circuit design and applications without discriminating between different operating frequencies, output powers, and the analog/digital domains. Specific topics in the book include: Next-generation CMOS circuit design and application; CMOS RF/microwave/millimeter-wave/terahertz-wave integrated circuits and systems; CMOS integrated circuits specially used for wireless or wired systems and applications such as converters, sensors, interfaces, frequency synthesizers/generators/rectifiers, and so on; Algorithm and signal-processing methods to improve the performance of CMOS circuits and systems.

spin memristor --- mask operation --- memristor switch --- memristor crossbar --- image processing --- CMOS --- voltage-controlled oscillator --- switched-biasing --- flicker noise --- phase noise --- current source --- figure-of-merit --- pixel-level ADC --- current-input ADC --- readout circuit --- microbolometer --- high SNR --- wide dynamic range --- current-reuse --- injection-locked frequency divider --- radar sensor --- wideband --- RF receiver --- blocker --- second-order intermodulation (IM2) --- orthogonal frequency division modulation (OFDM) --- MedRadio --- medical implanted communication service (MICS) --- biomedical device --- biosensors --- LC-VCO --- current-shaping --- 90 nm --- current tail --- varactor --- LC tank --- on-wafer --- vibration energy harvester --- power management circuit --- CMOS rectifier --- dynamic threshold cancellation technique --- high power conversion efficiency --- CMOS circuit --- analog system --- signal processing --- learning algorithm --- artificial neural network --- freeware --- open science --- analog microelectronics design --- long channel transistors --- short channel transistors --- integrated circuit design --- CMOS design --- VLSI --- higher education --- educational innovation --- integrated circuit layout --- complex thinking --- CMOS detector --- concurrent-mode --- differential detector IC --- imaging SNR --- integrated folded-dipole antenna --- sub-terahertz imaging --- voltage responsivity