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Integrated circuits --- Superconductors. --- Design and construction. --- Superconducting materials --- Superconductive devices --- Cryoelectronics --- Electronics --- Solid state electronics --- Materials

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction. --- 3D ICs (Three-dimensional integrated circuits) --- Integrated circuits

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional integrated circuits --- Design and construction.

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Timing Optimization Through Clock Skew Scheduling focuses on optimizing the timing of large scale, high performance, digital synchronous systems. A particular emphasis is placed on algorithms for non-zero clock skew scheduling to improve the performance and reliability of VLSI circuits. This research monograph answers the need for a broad introduction to state-of-the-art clock skew scheduling algorithms from a circuit, graph, and mathematical optimization background. A detailed description of clock skew scheduling application on edge-triggered and level-sensitive circuits, synchronized with single and multi-phase clocking schemes, and formulated as linear programming (LP) and quadratic programming (QP) formulations are provided along with an analysis of optimal computer solution techniques. Theoretical limits of improvement in clock frequency through clock skew scheduling are highlighted. Hints and a preliminary implementation of a parallel skew scheduling application are also included. Timing Optimization Through Clock Skew Scheduling contains sufficient detail for the advanced CAD algorithm developer, researcher and graduate student. Furthermore, with the material provided on timing properties and optimization, those readers with less background can also benefit from this book.

Computer networks. --- Synchronization. --- Timing circuits -- Design and construction. --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Integrated circuits --- Timing circuits --- Very large scale integration --- Design and construction. --- Synchronism --- Engineering. --- Computer-aided engineering. --- Electrical engineering. --- Electronics. --- Microelectronics. --- Electronic circuits. --- Circuits and Systems. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Electronics and Microelectronics, Instrumentation. --- Electronic circuits --- Time measurements --- Systems engineering. --- Computer engineering. --- Computer aided design. --- Electrical engineering --- Physical sciences --- CAD (Computer-aided design) --- Computer-assisted design --- Computer-aided engineering --- Design --- Computers --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- CAE --- Electric engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Data processing

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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Electrical Engineering --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electric circuits. --- Circuits, Electric --- Electric lines --- Systems engineering. --- Electronics. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Electrical engineering --- Physical sciences --- Engineering systems --- System engineering --- Engineering --- Industrial engineering --- System analysis --- Design and construction --- Electronic circuits. --- Microelectronics. --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Variable capacitors --- Very high speed integrated circuits --- VHSIC --- Integrated circuits --- Capacitors --- Power supply --- Very large scale integration --- NETWORKS ON A CHIP, NOC (MIKROELEKTRONIK) --- SYSTEM ON A CHIP, SOC (MIKROELEKTRONIK) --- SCHALTKREISENTWURF (MIKROELEKTRONIK) --- LEISTUNG (COMPUTERSYSTEME) --- FACHLICHE NACHSCHLAGEWERKE + FACHLEXIKA + HANDBÜCHER (DOKUMENTENTYP) --- NETWORKS ON A CHIP, NOC (MICROELECTRONICS) --- NETWORKS ON A CHIP, NOC (MICROÉLECTRONIQUE) --- SYSTEM ON A CHIP, SOC (MICROÉLECTRONIQUE) --- SYSTEM ON A CHIP, SOC (MICROELECTRONICS) --- DESSIN DES CIRCUITS IMPRIMÉS (MICROÉLECTRONIQUE) --- CIRCUIT DESIGN (MICROELECTRONICS) --- PERFORMANCE (COMPUTER SYSTEMS) --- PERFORMANCE (SYSTÈMES INFORMATIQUES) --- OUVRAGES DE RÉFÉRENCE SPÉCIALISÉS + ENCYCLOPÉDIES SPÉCIALISÉES + MANUELS (TYPE DE DOCUMENT) --- SPECIALIZED REFERENCE WORKS + SPECIALIZED ENCYCLOPAEDIAS + HANDBOOKS (DOCUMENT TYPE)