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"Thermal Inertia in Energy Efficient Building Envelopes provides the optimal solutions, tools and methods for designing the energy efficient envelopes that will reduce energy consumption and achieve thermal comfort and low environmental impact. Thermal Inertia in Energy Efficient Building Envelopes provides experimental data, technical solutions and methods for quantifying energy consumption and comfort levels, also considering dynamic strategies such as thermal inertia and natural ventilation. Several type of envelopes and their optimal solutions are covered, including retrofit of existing envelopes, new solutions, passive systems such as ventilated facades and solar walls."--Provided by publisher.

Insulation (Heat) --- Buildings --- Environmental engineering.

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Corrosion under insulation (CUI) refers to the external corrosion of piping and vessels that occurs underneath externally clad/jacketed insulation as a result of the penetration of water. By its very nature CUI tends to remain undetected until the insulation and cladding/jacketing is removed to allow inspection or when leaks occur. CUI is a common problem shared by the refining, petrochemical, power, industrial, onshore and offshore industries.The European Federation of Corrosion (EFC) Working Parties WP13 and WP15 have worked to provide guidelines on managing CUI together with a numbe

Insulation (Heat) --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Thermal properties

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This book has been written to present elementary practical and efficient applications in saving energy concept, as well as propose a solitary action for this category of topics. The book aims to illustrate various methods in treatment the concept of thermal insulation such as processes and the attempt to build an efficient passive building model.

Buildings --- Insulation (Heat) --- Energy conservation. --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Thermal properties --- Building construction & materials

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Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. Set 2: Thermal Packaging Tools: The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, product managers, as well as to researchers in thermal management of electronic and photonic components and systems. It is most beneficial to undergraduate and graduate students studying mechanical, electrical and electronic engineering.

Electronic packaging. --- Insulation (Heat) --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Packaging (Electronics) --- Electronic apparatus and appliances --- Electronics --- Thermal properties

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"The purpose of this User's Manual is to aid in understanding and complying with the requirements of ASHRAE/IES Standard 90.1-2016 as published in its entirety"--

Tall buildings --- Buildings --- Insulation (Heat) --- Thermal properties --- Energy conservation --- Standards --- ASHRAE (Firm). --- Heat insulating materials --- Thermal insulation --- Heating --- Exterior walls --- Edifices --- Halls --- Structures --- Architecture --- High buildings --- High-rise buildings --- Highrise buildings --- Multistory buildings --- Built environment