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Book
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
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ISBN: 1728167736 1728167744 Year: 2020 Publisher: Piscataway, New Jersey : IEEE,

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Book
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
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ISBN: 0780392922 0780392930 1509099247 Year: 2005 Publisher: [Place of publication not identified] I E E E

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Book
2005 6th International Conference on Electronic Packaging Technology
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ISBN: 0780394496 1509099360 Year: 2005 Publisher: [Place of publication not identified] I E E E

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Book
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
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ISBN: 1424413923 1424413915 1509089691 Year: 2007 Publisher: Piscataway, New Jersey : Institute of Electrical and Electronics Engineers,

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Book
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
Authors: ---
ISBN: 1424490685 1424490693 1424490707 Year: 2010 Publisher: [Place of publication not identified] I E E E

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Book
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium
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ISBN: 1467314447 1467314455 1467314439 Year: 2012 Publisher: [Place of publication not identified] IEEE

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Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
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ISBN: 1479923133 147993741X 1479923117 Year: 2013 Publisher: Piscataway, N.J. : IEEE,

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2014 International Conference on Electronics Packaging (ICEP)
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ISBN: 4904090101 1479933678 490409011X Year: 2014 Publisher: Piscataway, NJ : IEEE,

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Annotation ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.


Book
2016 International Conference on Electronics Packaging (ICEP) : 20-22 April 2016, Hokkaido, Japan
Author:
ISBN: 4904090160 1509019278 4904090179 Year: 2016 Publisher: Piscataway, New Jersey : IEEE,

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ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling simulation, and applications.


Book
2012 IEEE CPMT Symposium Japan
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ISBN: 1467326550 1467326542 Year: 2013 Publisher: [Place of publication not identified] IEEE

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