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Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Hybrid integrated circuits. --- Microelectronics. --- Hybrid integrated circuits --- Microelectronics --- Microminiature electronic equipment --- Microminiaturization (Electronics) --- Electronics --- Microtechnology --- Semiconductors --- Miniature electronic equipment --- Integrated circuits --- Electronic circuits. --- Manufactures. --- Climate change. --- Electrical engineering. --- Circuits and Systems. --- Manufacturing, Machines, Tools, Processes. --- Climate Change. --- Electrical Engineering. --- Electric engineering --- Engineering --- Changes, Climatic --- Changes in climate --- Climate change --- Climate change science --- Climate changes --- Climate variations --- Climatic change --- Climatic changes --- Climatic fluctuations --- Climatic variations --- Global climate changes --- Global climatic changes --- Climatology --- Climate change mitigation --- Teleconnections (Climatology) --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Environmental aspects
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This book had its nucleus in some lectures given by one of us (J. O’M. B. ) in a course on electrochemistry to students of energy conversion at the University of Pennsyl- nia. It was there that he met a number of people trained in chemistry, physics, biology, metallurgy, and materials science, all of whom wanted to know something about electrochemistry. The concept of writing a book about electrochemistry which could be understood by people with very varied backgrounds was thereby engendered. The lectures were recorded and written up by Dr. Klaus Muller as a 293-page manuscript. At a later stage, A. K. N. R. joined the effort; it was decided to make a fresh start and to write a much more comprehensive text. Of methods for direct energy conversion, the electrochemical one is the most advanced and seems the most likely to become of considerable practical importance. Thus, conversion to electrochemically powered transportation systems appears to be an important step by means of which the difficulties of air pollution and the effects of an increasing concentration in the atmosphere of carbon dioxide may be met. Cor- sion is recognized as having an electrochemical basis. The synthesis of nylon now contains an important electrochemical stage. Some central biological mechanisms have been shown to take place by means of electrochemical reactions. A number of American organizations have recently recommended greatly increased activity in training and research in electrochemistry at universities in the United States
fysicochemie --- Electrochemistry --- Ions. --- Electrochemistry. --- Chemistry. --- Analytical chemistry. --- Physical chemistry. --- Analytical Chemistry. --- Physical Chemistry. --- Neurosciences. --- Pharmacology. --- Chemical engineering. --- Climate change. --- Materials science. --- Industrial Chemistry/Chemical Engineering. --- Pharmacology/Toxicology. --- Characterization and Evaluation of Materials. --- Climate Change. --- Polymers. --- Polymer Sciences. --- 541.13 --- #WSCH:AAS3 --- Chemistry, Physical and theoretical --- 541.13 Electrochemistry --- Electrochemical analysis. --- Chemistry, Physical and theoretical. --- Electrochimie --- EPUB-LIV-FT SPRINGER-B --- Analytical biochemistry. --- Chemistry, Physical organic. --- Toxicology. --- Surfaces (Physics). --- Climatic changes. --- Monograph --- Polymers . --- Changes, Climatic --- Changes in climate --- Climate change --- Climate change science --- Climate changes --- Climate variations --- Climatic change --- Climatic changes --- Climatic fluctuations --- Climatic variations --- Global climate changes --- Global climatic changes --- Climatology --- Climate change mitigation --- Teleconnections (Climatology) --- Neural sciences --- Neurological sciences --- Neuroscience --- Medical sciences --- Nervous system --- Material science --- Physical sciences --- Drug effects --- Medical pharmacology --- Chemicals --- Chemotherapy --- Drugs --- Pharmacy --- Chemistry, Industrial --- Engineering, Chemical --- Industrial chemistry --- Engineering --- Chemistry, Technical --- Metallurgy --- Environmental aspects --- Physiological effect --- Chemistry, Theoretical --- Physical chemistry --- Theoretical chemistry --- Chemistry --- Analysis, Chemical --- Analytic chemistry --- Chemical analysis --- Chemistry, Analytic --- Polymere --- Polymeride --- Polymers and polymerization --- Macromolecules --- Research. --- Chemical research --- Research
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