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ESD Design for Analog Circuits covers many challenging topics related to analog circuit design for both ESD device and ESD circuits at the network level. The chapters cover technical material on seven different hierarchical levels starting from elementary semiconductor structures, ESD device and clamp levels up to ESD protection network design followed by complex case studies for analog circuit design examples. Included is an extensive discussion of ESD design aspects for analog design for signal path products covering both major principles and specific case studies for DC-DC buck/boost converters, level shifters, digital-analog converters, high speed and precision power amplifiers, interface applications and system level protection. At the same time, the authors introduce a novel companion study tool for ESD protection solutions. Quick-start learning is combined with in-depth understanding for the whole spectrum of cross-disciplinary knowledge needed for excelling in the ESD field. The material combines textbook material with optional numerical simulation experience. Instructions for obtaining the simulation examples and trial version of DECIMMTM software can be found on the book's companion website www.analogesd.com. The simulation examples prepared by the authors support the specific examples discussed across the book chapters. ESD Design for Analog Circuits is a useful reference for device engineers and circuit designers addressing Analog IC Design problems.

Engineering. --- Circuits and Systems. --- Electronics and Microelectronics, Instrumentation. --- Electronics. --- Systems engineering. --- Ingénierie --- Electronique --- Ingénierie des systèmes --- Analog electronic systems --- Electric discharges. --- Electronic circuit design. --- Design and construction. --- Electric discharges --- Electronic circuit design --- Electronic circuits --- Discharges (Electricity) --- Electricity --- Electrostatic discharges --- Analog electronic devices --- Design and construction --- Design --- Discharges --- Electrostatics --- Nuclear physics --- Electric action of points --- Photoelectricity --- Electronic systems

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Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Microelectronic packaging --- Handbooks, manuals, etc. --- Electronic circuits. --- Microprogramming . --- Manufactures. --- Electrical engineering. --- Circuits and Systems. --- Control Structures and Microprogramming. --- Manufacturing, Machines, Tools, Processes. --- Electrical Engineering. --- Electric engineering --- Engineering --- Manufactured goods --- Manufactured products --- Products --- Products, Manufactured --- Commercial products --- Manufacturing industries --- Computer programming --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Packaging (Microelectronics) --- Electronic packaging --- Microelectronics --- Microelectronic packaging - Handbooks, manuals, etc.

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by Kurt Keutzer Those looking for a quick overview of the book should fast-forward to the Introduction in Chapter 1. What follows is a personal account of the creation of this book. The challenge from Earl Killian, formerly an architect of the MIPS processors and at that time Chief Architect at Tensilica, was to explain the significant performance gap between ASICs and custom circuits designed in the same process generation. The relevance of the challenge was amplified shortly thereafter by Andy Bechtolsheim, founder of Sun Microsystems and ubiquitous investor in the EDA industry. At a dinner talk at the 1999 International Symposium on Physical Design, Andy stated that the greatest near-term opportunity in CAD was to develop tools to bring the performance of ASIC circuits closer to that of custom designs. There seemed to be some synchronicity that two individuals so different in concern and character would be pre-occupied with the same problem. Intrigued by Earl and Andy’s comments, the game was afoot. Earl Killian and other veterans of microprocessor design were helpful with clues as to the sources of the performance discrepancy: layout, circuit design, clocking methodology, and dynamic logic. I soon realized that I needed help in tracking down clues. Only at a wonderful institution like the University of California at Berkeley could I so easily commandeer an ab- bodied graduate student like David Chinnery with a knowledge of architecture, circuits, computer-aided design and algorithms.

Application specific integrated circuits --- ASICs (Integrated circuits) --- Electronic circuits. --- Electrical engineering. --- Computer-aided engineering. --- Circuits and Systems. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Integrated circuits --- CAE --- Engineering --- Electric engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Data processing --- Application-specific integrated circuits.

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This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua­ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des­ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Integrated circuits --- Semiconductors --- Very large scale integration --- Junctions --- Electronic circuits. --- Electrical engineering. --- Computer-aided engineering. --- Circuits and Systems. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- CAE --- Engineering --- Electric engineering --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Data processing

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In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.

Integrated circuits --- Electronic circuits --- Circuits intégrés --- Circuits électroniques --- Design and construction. --- Noise. --- Conception et construction --- Bruit --- -Integrated circuits --- Electron-tube circuits --- Electric circuits --- Electron tubes --- Electronics --- Noise --- Computer aided design. --- Computer engineering. --- Electronic circuits - Noise. --- Engineering. --- Integrated circuits. --- Systems engineering. --- Electrical & Computer Engineering --- Engineering & Applied Sciences --- Electrical Engineering --- Design and construction --- Computer-aided engineering. --- Electrical engineering. --- Electronic circuits. --- Circuits and Systems. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- Noisy circuits --- CAE --- Engineering --- Electric engineering --- Data processing