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Book
Wearable Sensors Applied in Movement Analysis
Authors: --- ---
ISBN: 3036558594 3036558608 Year: 2022 Publisher: Basel MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

Recent advances in electronics have led to sensors whose sizes and weights are such that they can be placed on living systems without impairing their natural motion and habits. They may be worn on the body as accessories or as part of the clothing and enable personalized mobile information processing. Wearable sensors open the way for a nonintrusive and continuous monitoring of body orientation, movements, and various physiological parameters during motor activities in real-life settings. Thus, they may become crucial tools not only for researchers, but also for clinicians, as they have the potential to improve diagnosis, better monitor disease development and thereby individualize treatment. Wearable sensors should obviously go unnoticed for the people wearing them and be intuitive in their installation. They should come with wireless connectivity and low-power consumption. Moreover, the electronics system should be self-calibrating and deliver correct information that is easy to interpret. Cross-platform interfaces that provide secure data storage and easy data analysis and visualization are needed.This book contains a selection of research papers presenting new results addressing the above challenges.


Book
Advances of Italian Machine Design
Authors: ---
Year: 2021 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This 2028 Special Issue presents recent developments and achievements in the field of Mechanism and Machine Science coming from the Italian community with international collaborations and ranging from theoretical contributions to experimental and practical applications. It contains selected contributions that were accepted for presentation at the Second International Conference of IFToMM Italy, IFIT2018, that has been held in Cassino on 29 and 30 November 2018. This IFIT conference is the second event of a series that was established in 2016 by IFToMM Italy in Vicenza. IFIT was established to bring together researchers, industry professionals and students, from the Italian and the international community in an intimate, collegial and stimulating environment.


Book
Science, Characterization and Technology of Joining and Welding
Author:
ISBN: 3039289985 3039289977 Year: 2020 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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As the Guest Editor of this Special Issue entitled ""Science, Characterization, and Technology of Joining and Welding"" of Metals, I am pleased to have this book published by MDPI. Joining, including welding, soldering, brazing, and assembly, is an essential requirement in manufacturing processes and is classified as a secondary manufacturing process. This Special Issue of Metals includes technical and review papers on, but not limited to, different aspects of joining and welding, including welding technologies (i.e., fusion-based welding and solid-state welding), characterization, metallurgy and materials science, quality control, and design and numerical simulation. This Special Issue also includes the joining of different materials, including metal and non-metals (polymers and composites), including 17 peer-reviewed papers from several researchers all around the globe (China, Germany, Brazil, South Koria, Slovakia, USA, Taiwan, Canada, and India). As of this date (April 2020), the papers in this Special Issue have been cited 47 times by other researchers, which I think is an eminent number and shows the high quality of the published papers in this Issue. This Special Issue includes a large diversity of various subjects in the field of joining: laser welding, friction stir welding, diffusion bonding, multipass welding, rotary friction-welding, friction bit joining, adhesive bonding, weldbonding, simulation and experimentation, metal/FRP joints, welding simulation, plasma–TIG coupled arc welding, liquation cracking, soldering, resin bonding, microstructural characteristics, brazing, and friction stir butt and scarf welding. I would like to sincerely thank all the researchers who contributed to this Special Issue for their high-quality research. I also would like to acknowledge Mr. Toliver Guo, Senior Assistant Editor at MDPI, who continuously and tirelessly contributed toward this Special Issue by assisting me with inviting the authors and the follow ups. I think this Special Issue will enhance our knowledge and understanding in the field of joining and assembly. I would like to dedicate this book to my wife, Mehrnoosh, for her continued support and encouragement.

Keywords

microstructure --- phased array ultrasonic --- thermophysical property --- FRP --- simulation --- eutectoid --- tint etching --- TAN alloy --- dissimilar material joining --- thermal compression bonding --- HAZ cracking --- welding thermal cycles --- IN738 superalloy --- carbide dissolution --- solder --- friction bit joining --- weld bonding --- interfacial microstructure --- adhesive thermos-mechanical property --- API 5L X80 steel --- scarf joint --- thermal spraying --- pores --- Cr-Mo steel --- welding --- hot pressing --- local brittle zone --- electrical properties --- Ti2AlNb alloy --- tool pin profiles --- adhesive bonding --- mechanical properties --- carbon fiber-reinforced polymer --- surface structuring --- m23c6 --- Zn-coated low carbon microalloyed steels --- flux-less soldering --- dissimilar joints --- energy-input --- medium thick plate model --- design of experiments --- oxide layer --- mechanical interlocking --- rotary friction-welding --- 22MnB5 --- ultrasonic bonding --- titanium --- anisotropy --- coupled arc --- heat-affected zone --- aluminum --- plasma-TIG --- joint mechanical properties --- hybrid joining --- microconstituent --- dual-phase steel --- high-crystalline content zirconia --- flex-on-board assembly --- active monomers --- butt joint --- copper --- clad filler foil --- SA213-T23 --- arc profile --- numerical simulation --- tailor welded blanks --- ceramics --- vacuum brazing --- coating --- longitudinal wave --- direct diffusion bonding --- metallurgy --- pressure distribution --- flow stress --- SnBi58 solder joint morphology --- adhesion --- dissimilar weldments --- laser welding --- distributed point heat sources model --- mechanical strength --- taguchi design --- bonding strength --- friction stir welding


Book
State-of-the-Art Polymer Science and Technology in Italy (2019,2020)
Authors: --- --- ---
Year: 2020 Publisher: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute

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Polymer science and technology in Italy represent long-lasting and interdisciplinary fields in which chemistry, physics, and engineering mix together to produce studies which are considered among the best in the world. Several research groups coming from very different fields often collaborate in the design of the material, of the part, and of the processing technology to obtain innovative products with outstanding, new, and smart properties. Examples of the contributions of Italian research in the field are featured in top journals and conferences throughout the world. This Special Issue collects an overview of polymer science and technology in Italy. The research topics include: polymer composites and nanocomposites; biodegradable polymers; polymers with special properties and smart polymers; advanced characterization of polymers; new and innovative polymer processes; modeling of polymer processing; polymeric materials in additive manufacturing; process–properties relationships; polymeric parts for special applications.

Keywords

polyhedral oligomeric silsesquioxanes --- nanocomposites --- POSS --- polystyrene --- thermal behavior --- SEM analysis --- soy flour --- soy protein isolate --- insoluble carbohydrates --- periodate oxidation --- aldehydes generation --- condensation reactions --- soy adhesives --- biodegradable polymers --- rheological properties --- irrigation pipes --- soil burial test --- polyesters --- Bio-Flex® --- Mater-Bi® --- polymer degradation --- photo-oxidation --- pectin --- alginate --- biocomposites --- food packaging --- degradable films --- ionic liquids --- 3D printing --- digital light processing --- CO2 capture --- furanic polymer --- spectroscopy --- solid-state 13C-NMR --- FTIR --- Raman --- linear structure --- ring opening --- γ-lactone --- Diels-Alder --- SAS coprecipitation --- controlled drug delivery systems --- microparticles --- eudragit --- supercritical carbon dioxide --- dental materials --- composite resin --- layered double hydroxide --- calcium bentonite --- antibiofilm activity --- injection molding --- structure/properties relationship --- cavity temperature fast modulation --- chitosan --- cyclodextrin --- macromolecular complex --- dalargin --- enkephalin --- chymotrypsin --- NMR --- oral peptide delivery --- peptide stability --- cold-cure --- epoxy resins --- organic-inorganic hybrids --- sol-gel --- layered double hydroxides --- carbon nanotubes --- electrical properties --- polyphenols --- flavonoids --- furanics --- sulphur --- bio-polymers --- pentane --- heating value --- mulch films --- Ecovio® --- polylactide --- poly(butyleneadipate-co-butyleneterephtalate) --- polyethylene --- polymer melt --- primary and secondary relaxations --- Johari-Goldstein relaxation --- bond reorientation --- vibrational dynamics --- molecular-dynamics simulations --- UV-LED curing --- epoxy-acrylate resin --- biochar --- multiwalled carbon nanotubes --- composites --- reduced graphene oxide --- polyketone functionalization --- electrically-conductive nanocomposites --- UHMWPE --- wear tests --- bio-activity --- history --- cyclodextrin nanosponge --- crosslinked polymer --- diclofenac --- mefenamic acid --- molecular imprinting --- delayed addition --- binding isotherm --- binding selectivity --- imprinting factor --- polymers --- life cycle assessment --- polymeric materials --- sustainability --- plastic --- LCA --- additive manufacturing --- LCD printing --- epoxy --- polymer blends --- thermomechanical properties --- n/a

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