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Multi
Graphs in VLSI
Authors: ---
ISBN: 9783031110474 9783031110467 9783031110481 9783031110498 Year: 2023 Publisher: Cham Springer International Publishing

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Abstract

Networks are pervasive. Very large scale integrated (VLSI) systems are no different, consisting of dozens of interconnected subsystems, hundreds of modules, and many billions of transistors and wires. Graph theory is crucial for managing and analyzing these systems. In this book, VLSI system design is discussed from the perspective of graph theory. Starting from theoretical foundations, the authors uncover the link connecting pure mathematics with practical product development. This book not only provides a review of established graph theoretic practices, but also discusses the latest advancements in graph theory driving modern VLSI technologies, covering a wide range of design issues such as synchronization, power network models and analysis, and interconnect routing and synthesis. Provides a practical introduction to graph theory in the context of VLSI systems engineering; Reviews comprehensively graph theoretic methods and algorithms commonly used during VLSI product development process; Includes a review of novel graph theoretic methods and algorithms for VLSI system design.


Multi
Single Flux Quantum Integrated Circuit Design
Authors: ---
ISBN: 9783030768850 9783030768843 9783030768867 9783030768874 Year: 2022 Publisher: Cham Springer International Publishing

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High efficiency, large scale, stationary computing systems - supercomputers and data centers - are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application - superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, bias networks, and testability are described, and models, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems. Reviews modern research in the field of superconductive digital electronics, including novel devices and approaches; Provides comprehensive background on pertinent topics; Describes prospective methodologies for large scale integration of superconductive circuits.


Multi
Three-dimensional integrated circuit design
Authors: --- ---
ISBN: 9780124104846 0124104843 9780124105010 0124105017 9780124105010 Year: 2017 Publisher: Cambridge, Massachusetts : Morgan Kaufmann Publishers,

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization


Multi
Three-dimensional integrated circuit design
Authors: ---
ISBN: 9780123743435 0123743435 9780080921860 0080921868 Year: 2009 Publisher: Boston Morgan Kaufmann

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With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.


Digital
Single Flux Quantum Integrated Circuit Design
Authors: --- ---
ISBN: 9783031474750 9783031474743 9783031474767 9783031474774 Year: 2024 Publisher: Cham Springer International Publishing, Imprint: Springer

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Digital
Power Distribution Networks with On-Chip Decoupling Capacitors
Authors: --- ---
ISBN: 9780387716015 Year: 2008 Publisher: Boston, MA Springer Science + Business Media, LLC


Digital
Timing Optimization Through Clock Skew Scheduling
Authors: --- ---
ISBN: 9780387710563 Year: 2009 Publisher: Boston, MA Springer US


Multi
Power Distribution Networks with On-Chip Decoupling Capacitors
Authors: --- --- --- ---
ISBN: 9781441978714 Year: 2011 Publisher: New York, NY Springer New York

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Power Distribution Networks with On-Chip Decoupling Capacitors, 2nd edition is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. This book provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors. The book provides insight and intuition into the behavior and design of on-chip power distribution systems.    This book has four primary objectives. The first objective is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the terminals of the on-chip circuitry. The second objective is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for efficiently placing on-chip decoupling capacitors in nanoscale integrated circuits. Finally, the fourth objective is to suggest novel architectures for distributing power across an integrated circuit, as well as provide new methodologies to efficiently analyze and design on-chip power grids.   Organized into subareas to provide a more intuitive flow to the reader, this edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.


Digital
On-Chip Power Delivery and Management
Authors: --- --- --- --- --- et al.
ISBN: 9783319293950 Year: 2016 Publisher: Cham Springer International Publishing

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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

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