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Surface preparation

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The book is aimed at practitioners, engineers, researchers, students and teachers. The approach is direct, concise and authoritative. Progressing through each major element of the grinding system and then on to machine developments and process control, the reader becomes aware of all aspects of operation and design. Trends are described demonstrating key features. Coverage includes abrasives and super-abrasives, wheel design, dressing technology, machine accuracy and productivity, grinding machine design, high-speed grinding technology, cost optimization, ultra-precision grinding, process cont

Grinding and polishing. --- Surface preparation.

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Silicon --- Surfaces --- Congresses --- Surface preparation --- Conferences - Meetings

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Semiconductor wafers --- Silicon --- Surface preparation --- Cleaning --- Surfaces

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Principles of Modern Grinding Technology, Second Edition, provides insights into modern grinding technology based on the author's 40 years of research and experience in the field. It provides a concise treatment of the principles involved and shows how grinding precision and quality of results can be improved and costs reduced. Every aspect of the grinding process--techniques, machines and machine design, process control, and productivity optimization aspects--come under the searchlight. The new edition is an extensive revision and expansion of the first edition covering all t

Grinding and polishing. --- Buffing --- Lapping --- Polishing --- Machining --- Surface preparation