TY - BOOK ID - 9073526 TI - IEEE 2011 Semiconductor Conference Dresden : Technology, Design, Packaging, Simulation and Test : International Conference, Workshop and Table-Top Exhibition : September 27 to 28, 2011, Dresden, Germany. PY - 2011 SN - 1457704307 1457704315 PB - New York : IEEE, DB - UniCat KW - Semiconductors UR - https://www.unicat.be/uniCat?func=search&query=sysid:9073526 AB - ER -