TY - BOOK ID - 8284426 TI - Constrained deformation of materials : devices, heterogeneous structures and thermo-mechanical modeling PY - 2010 SN - 148998612X 1441963111 144196312X 1299196845 PB - New York : Springer, DB - UniCat KW - Deformations (Mechanics) -- Congresses. KW - Fibrous composites -- Fatigue. KW - Fracture mechanics. KW - Materials -- Fatigue. KW - Steel -- Metallurgy -- Congresses. KW - Deformations (Mechanics) KW - Micromechanics KW - Continuum mechanics KW - Microstructure KW - Numerical analysis KW - Engineering & Applied Sciences KW - Chemical & Materials Engineering KW - Applied Mathematics KW - Materials Science KW - Mathematical models KW - Engineering. KW - Mechanics. KW - Continuum mechanics. KW - Mechanical engineering. KW - Industrial engineering. KW - Production engineering. KW - Materials KW - Thin films. KW - Mechanical Engineering. KW - Industrial and Production Engineering. KW - Continuum Mechanics and Mechanics of Materials. KW - Surfaces and Interfaces, Thin Films. KW - Surfaces. KW - Elastic solids KW - Mechanics KW - Rheology KW - Strains and stresses KW - Structural failures KW - Mechanics, Applied. KW - Surfaces (Physics). KW - Classical Mechanics. KW - Solid Mechanics. KW - Physics KW - Surface chemistry KW - Surfaces (Technology) KW - Applied mechanics KW - Engineering, Mechanical KW - Engineering mathematics KW - Classical mechanics KW - Newtonian mechanics KW - Dynamics KW - Quantum theory KW - Management engineering KW - Simplification in industry KW - Engineering KW - Value analysis (Cost control) KW - Machinery KW - Steam engineering KW - Materials—Surfaces. KW - Films, Thin KW - Solid film KW - Solid state electronics KW - Solids KW - Coatings KW - Thick films KW - Manufacturing engineering KW - Process engineering KW - Industrial engineering KW - Mechanical engineering UR - https://www.unicat.be/uniCat?func=search&query=sysid:8284426 AB - "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike. ER -