TY - BOOK ID - 8277770 TI - Wire bonding in microelectronics : materials, processes, reliability, and yield PY - 1997 SN - 0070326193 PB - New York : McGraw-Hill, DB - UniCat KW - Wire bonding (Electronic packaging) KW - Electronic packaging KW - Semiconductors KW - Failures in semiconductors KW - System failures (Engineering) KW - Packaging (Electronics) KW - Electronic apparatus and appliances KW - Electronics KW - Lead bonding (Electronic packaging) KW - Wirebonding (Electronic packaging) KW - Metal bonding KW - Production control. KW - Reliability. KW - Defects. KW - Failures. KW - Defects KW - Reliability KW - Failures KW - Production control UR - https://www.unicat.be/uniCat?func=search&query=sysid:8277770 AB - ER -