TY - BOOK ID - 8211482 TI - Bio and nano packaging techniques for electron devices : advances in electronic device packaging AU - Gerlach, Gerald. AU - Wolter, Klaus-Jurgen. PY - 2012 SN - 3642442862 364228521X 9786613939401 3642285228 1283626950 PB - Berlin ; New York : Springer, DB - UniCat KW - Microelectronic packaging. KW - Nanotechnology. KW - Optical materials. KW - Surfaces (Physics). KW - Chemical & Materials Engineering KW - Engineering & Applied Sciences KW - Electrical & Computer Engineering KW - Technology - General KW - Materials Science KW - Electrical Engineering KW - Electronics. KW - Packaging (Microelectronics) KW - Materials science. KW - Electronic materials. KW - Materials Science. KW - Optical and Electronic Materials. KW - Characterization and Evaluation of Materials. KW - Electrical engineering KW - Physical sciences KW - Electronic packaging KW - Microelectronics KW - Physics KW - Surface chemistry KW - Surfaces (Technology) KW - Optics KW - Materials KW - Molecular technology KW - Nanoscale technology KW - High technology KW - Material science KW - Electronic materials UR - https://www.unicat.be/uniCat?func=search&query=sysid:8211482 AB - The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging. ER -