TY - BOOK ID - 78648246 TI - Development of sub-mm wave flip-chip interconnect PY - 2016 SN - 3736984103 9783736984103 9783736994102 PB - Gottingen, Germany : Cuvillier Verlag, DB - UniCat KW - Gold alloys. KW - Eutectic alloys. KW - Flip chip technology. KW - Flip chip devices KW - Electronic packaging KW - Alloys UR - https://www.unicat.be/uniCat?func=search&query=sysid:78648246 AB - ER -