TY - BOOK ID - 64875262 TI - 2018 13th International Congress Molded Interconnect Devices : September 25-26 2018, Würzburg, Germany AU - International Congress Molded Interconnect Devices AU - IEEE Electronics Packaging Society PY - 2018 SN - 1538649330 1538649349 PB - Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, DB - UniCat KW - Molded interconnect devices KW - Three-dimensional display systems KW - Interconnect devices, Molded KW - MIDs (Molded interconnect devices) KW - Electronic circuits UR - https://www.unicat.be/uniCat?func=search&query=sysid:64875262 AB - ER -