TY - BOOK ID - 64871899 TI - 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) : proceedings : October 26 (Wed) - 28 (Fri), 2016, Taipei Nangang Exhibition Center PY - 2016 SN - 1509047697 1509047700 PB - Piscataway, NJ : IEEE, DB - UniCat KW - Microelectromechanical systems KW - Microelectronic packaging UR - https://www.unicat.be/uniCat?func=search&query=sysid:64871899 AB - Annotation The Internet of Things, including wearable devices and smart home products, will again be a big theme To cater for the technology trends, the theme of IMPACT IAAC 2016 highlights IMPACT on the Next Big Things and will arrange panel sessions, invited talks, industrial sessions and outstanding paper presentations. ER -