TY - BOOK ID - 63087014 TI - Ionized physical vapor deposition PY - 2000 SN - 0125330278 9786611054342 1281054348 008054293X 9780125330275 9780080542935 9781281054340 6611054340 PB - San Diego Academic Press DB - UniCat KW - Thin film devices KW - -Thin films KW - Physical vapor deposition KW - Deposition, Physical vapor KW - PVD (Physical vapor deposition) KW - Vapor deposition, Physical KW - Vapor-plating KW - Films, Thin KW - Solid film KW - Solid state electronics KW - Solids KW - Surfaces (Technology) KW - Coatings KW - Thick films KW - Devices, Thin film KW - Electronic apparatus and appliances KW - Thin films KW - Design and construction KW - Vapor-plating. KW - Thin films. KW - Coating, Vacuum KW - Deposition, Vapor KW - Vacuum coating KW - Vacuum metallizing KW - Vapor deposition KW - Vapor-phase deposition KW - Ion plating KW - Plating KW - Protective coatings KW - Refractory materials KW - Vacuum technology KW - Design and construction. UR - https://www.unicat.be/uniCat?func=search&query=sysid:63087014 AB - This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the fi ER -