TY - BOOK ID - 50699182 TI - Development of CMOS-MEMS/NEMS Devices AU - Verd, Jaume AU - Segura, Jaume PY - 2019 SN - 3039210696 3039210688 PB - MDPI - Multidisciplinary Digital Publishing Institute DB - UniCat KW - encapsulation KW - n/a KW - NEM memory switch KW - magnetotransistor KW - gas sensor KW - nano-system array KW - metal oxide (MOX) sensor KW - capacitive pressure sensor KW - real-time temperature compensation loop KW - mechanical relays KW - single-crystal silicon (SC-Si) KW - MEMS relays KW - MEMS KW - oscillator KW - micro-electro-mechanical system (MEMS) KW - uncooled IR-bolometer KW - microelectromechanical systems KW - microbolometer KW - programmable sustaining amplifier KW - micro sensor KW - CMOS-MEMS KW - pierce oscillator KW - MEMS resonators KW - micro/nanoelectromechanical systems (MEMS/NEMS) KW - resonator KW - microhotplate KW - NEMS KW - application-specific integrated circuit (ASIC) KW - MEMS modelling KW - magnetic field KW - chopper instrumentation amplifier KW - microresonators KW - interface circuit KW - Hall effect KW - thermal detector KW - temperature sensor KW - infrared sensor KW - CMOS–NEMS KW - CMOS KW - atomic force microscope KW - MEMS switches KW - stent KW - micro-electro-mechanical systems (MEMS) sensors KW - nano resonator KW - silicon-on-insulator (SOI) KW - MEMS-ASIC integration KW - Sigma-Delta KW - MEMS characterization KW - high-Q capacitive accelerometer KW - mass sensors KW - M3D KW - CMOS-NEMS UR - https://www.unicat.be/uniCat?func=search&query=sysid:50699182 AB - Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).] ER -