TY - BOOK ID - 48113310 TI - Particles in Contact : Micro Mechanics, Micro Process Dynamics and Particle Collective PY - 2019 SN - 3030158993 3030158985 PB - Cham : Springer International Publishing : Imprint: Springer, DB - UniCat KW - Granular materials. KW - Surfaces (Physics). KW - Surfaces and Interfaces, Thin Films. KW - Classical Electrodynamics. KW - Materials Engineering. KW - Physics KW - Surface chemistry KW - Surfaces (Technology) KW - Materials—Surfaces. KW - Thin films. KW - Optics. KW - Electrodynamics. KW - Engineering—Materials. KW - Dynamics KW - Light KW - Films, Thin KW - Solid film KW - Solid state electronics KW - Solids KW - Coatings KW - Thick films UR - https://www.unicat.be/uniCat?func=search&query=sysid:48113310 AB - This book contains the latest scientific findings in the area of granular materials, their physical fundamentals and applications in particle technology focused on the description of interactions of fine adhesive particles. In collaboration between physicists, chemists, mathematicians and mechanics and process engineers from 24 universities, new theories and methods for multiscale modeling and reliable measurement of particles are developed, with a focus on: • Basic physical-chemical processes in the contact zone: particle-particle and particle-wall contacts, • Particle collisions and their dynamics • Constitutive material laws for particle systems on the macro level. ER -