TY - BOOK ID - 145815772 TI - Latest Advances in Electrothermal Models AU - Górecki, Krzysztof AU - Górecki, Paweł PY - 2021 PB - Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute DB - UniCat KW - History of engineering & technology KW - Dual-Phase-Lag heat transfer model KW - thermal simulation algorithm KW - thermal measurements KW - Finite Difference Method scheme KW - Grünwald–Letnikov fractional derivative KW - Krylov subspace-based model order reduction KW - algorithm efficiency analysis KW - relative error analysis KW - algorithm convergence analysis KW - computational complexity analysis KW - finite difference method scheme KW - BJT KW - modelling KW - self-heating KW - silicon carbide KW - SPICE KW - IGBT KW - DC–DC converter KW - electrothermal model KW - averaged model KW - thermal phenomena KW - diode–transistor switch KW - power electronics KW - multi-LED lighting modules KW - device thermal coupling KW - compact thermal models KW - temperature sensors KW - microprocessor KW - throughput improvement KW - inductors KW - ferromagnetic cores KW - thermal model KW - transient thermal impedance KW - thermal resistance KW - electrothermal (ET) simulation KW - finite-element method (FEM) KW - model-order reduction (MOR) KW - multicellular power MOSFET KW - silicon carbide (SiC) KW - Dual-Phase-Lag heat transfer model KW - thermal simulation algorithm KW - thermal measurements KW - Finite Difference Method scheme KW - Grünwald–Letnikov fractional derivative KW - Krylov subspace-based model order reduction KW - algorithm efficiency analysis KW - relative error analysis KW - algorithm convergence analysis KW - computational complexity analysis KW - finite difference method scheme KW - BJT KW - modelling KW - self-heating KW - silicon carbide KW - SPICE KW - IGBT KW - DC–DC converter KW - electrothermal model KW - averaged model KW - thermal phenomena KW - diode–transistor switch KW - power electronics KW - multi-LED lighting modules KW - device thermal coupling KW - compact thermal models KW - temperature sensors KW - microprocessor KW - throughput improvement KW - inductors KW - ferromagnetic cores KW - thermal model KW - transient thermal impedance KW - thermal resistance KW - electrothermal (ET) simulation KW - finite-element method (FEM) KW - model-order reduction (MOR) KW - multicellular power MOSFET KW - silicon carbide (SiC) UR - https://www.unicat.be/uniCat?func=search&query=sysid:145815772 AB - This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale. ER -