TY - BOOK ID - 145533433 TI - MEMS Packaging Technologies and 3D Integration PY - 2022 PB - MDPI - Multidisciplinary Digital Publishing Institute DB - UniCat KW - Research & information: general KW - Biology, life sciences KW - heterogeneous integration KW - wafer bonding KW - wafer sealing KW - room-temperature bonding KW - Au-Au bonding KW - surface activated bonding KW - Au film thickness KW - surface roughness KW - microelectromechanical systems (MEMS) packaging KW - inkjet printing KW - redistribution layers KW - capacitive micromachined ultrasound transducers (CMUT) KW - fan-out wafer-level packaging (FOWLP) KW - adhesion KW - thin film metal KW - parylene KW - neural probe KW - scotch tape test KW - FEM KW - MEMS resonator KW - temperature coefficient KW - thermal stress KW - millimeter-wave KW - redundant TSV KW - equivalent circuit model KW - S-parameters extraction KW - technology evaluation KW - MEMS and IC integration KW - MCDM KW - fuzzy AHP KW - fuzzy VIKOR KW - fan-out wafer-level package KW - finite element KW - glass substrate KW - reliability life KW - packaging-on-packaging KW - thermal sensors KW - TMOS sensor KW - finite difference time domain KW - optical and electromagnetics simulations KW - finite element analysis KW - ultrasonic bonding KW - metal direct bonding KW - microsystem integration KW - biocompatible packaging KW - implantable KW - reliability KW - Finite element method (FEM) KW - simulation KW - multilayer reactive bonding KW - integrated nanostructure-multilayer reactive system KW - spontaneous self-ignition KW - self-propagating exothermic reaction KW - Pd/Al reactive multilayer system KW - Ni/Al reactive multilayer system KW - low-temperature MEMS packaging KW - crack propagation KW - microbump KW - deflection angle KW - stress intensity factor (SIF) KW - polymer packaging KW - neural interface KW - chronic implantation KW - heterogeneous integration KW - wafer bonding KW - wafer sealing KW - room-temperature bonding KW - Au-Au bonding KW - surface activated bonding KW - Au film thickness KW - surface roughness KW - microelectromechanical systems (MEMS) packaging KW - inkjet printing KW - redistribution layers KW - capacitive micromachined ultrasound transducers (CMUT) KW - fan-out wafer-level packaging (FOWLP) KW - adhesion KW - thin film metal KW - parylene KW - neural probe KW - scotch tape test KW - FEM KW - MEMS resonator KW - temperature coefficient KW - thermal stress KW - millimeter-wave KW - redundant TSV KW - equivalent circuit model KW - S-parameters extraction KW - technology evaluation KW - MEMS and IC integration KW - MCDM KW - fuzzy AHP KW - fuzzy VIKOR KW - fan-out wafer-level package KW - finite element KW - glass substrate KW - reliability life KW - packaging-on-packaging KW - thermal sensors KW - TMOS sensor KW - finite difference time domain KW - optical and electromagnetics simulations KW - finite element analysis KW - ultrasonic bonding KW - metal direct bonding KW - microsystem integration KW - biocompatible packaging KW - implantable KW - reliability KW - Finite element method (FEM) KW - simulation KW - multilayer reactive bonding KW - integrated nanostructure-multilayer reactive system KW - spontaneous self-ignition KW - self-propagating exothermic reaction KW - Pd/Al reactive multilayer system KW - Ni/Al reactive multilayer system KW - low-temperature MEMS packaging KW - crack propagation KW - microbump KW - deflection angle KW - stress intensity factor (SIF) KW - polymer packaging KW - neural interface KW - chronic implantation UR - https://www.unicat.be/uniCat?func=search&query=sysid:145533433 AB - This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation. ER -