TY - BOOK ID - 14308663 TI - Designing TSVs for 3D integrated circuits AU - Khan, Nauman. AU - Hassoun, Soha. PY - 2013 SN - 21918112 SN - 1461455073 1461455081 1283640368 PB - New York : Springer, DB - UniCat KW - Circuits and systems. KW - Electronics. KW - Engineering. KW - Three-dimensional integrated circuits -- Design. KW - Three-dimensional integrated circuits KW - Electrical & Computer Engineering KW - Engineering & Applied Sciences KW - Electrical Engineering KW - Three-dimensional integrated circuits. KW - Integrated circuits. KW - Chips (Electronics) KW - Circuits, Integrated KW - Computer chips KW - Microchips KW - 3D ICs (Three-dimensional integrated circuits) KW - Microprocessors. KW - Microelectronics. KW - Electronic circuits. KW - Circuits and Systems. KW - Processor Architectures. KW - Electronics and Microelectronics, Instrumentation. KW - Electronic circuits KW - Microelectronics KW - Integrated circuits KW - Systems engineering. KW - Computer science. KW - Electrical engineering KW - Physical sciences KW - Informatics KW - Science KW - Engineering systems KW - System engineering KW - Engineering KW - Industrial engineering KW - System analysis KW - Design and construction KW - Microminiature electronic equipment KW - Microminiaturization (Electronics) KW - Electronics KW - Microtechnology KW - Semiconductors KW - Miniature electronic equipment KW - Minicomputers KW - Electron-tube circuits KW - Electric circuits KW - Electron tubes UR - https://www.unicat.be/uniCat?func=search&query=sysid:14308663 AB - This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper. ER -