TY - BOOK ID - 14305790 TI - Three dimensional system integration : IC stacking process and design AU - Papanikolaou, Antonis. AU - Soudris, Dimitrios AU - Radojcic, Riko. PY - 2010 SN - 1441909613 9786613083425 1441909621 1283083426 1489981829 PB - New York : Springer, DB - UniCat KW - Microelectronic packaging. KW - Packaging -- Materials. KW - Electrical & Computer Engineering KW - Art, Architecture & Applied Arts KW - Engineering & Applied Sciences KW - Electrical Engineering KW - Architecture KW - Integrated circuit layout. KW - Integrated circuits KW - Layout, Integrated circuit KW - Design and construction. KW - Architecture. KW - Construction. KW - Electronic circuits. KW - Architecture / Design. KW - Basics of Construction. KW - Circuits and Systems. KW - Design and construction KW - Systems engineering. KW - Engineering systems KW - System engineering KW - Engineering KW - Industrial engineering KW - System analysis KW - Architecture, Western (Western countries) KW - Building design KW - Buildings KW - Construction KW - Western architecture (Western countries) KW - Art KW - Building KW - Electron-tube circuits KW - Electric circuits KW - Electron tubes KW - Electronics KW - Building. KW - Engineering. KW - Industrial arts KW - Technology KW - Architectural engineering KW - Construction science KW - Engineering, Architectural KW - Structural design KW - Structural engineering KW - Construction industry KW - Architecture, Primitive UR - https://www.unicat.be/uniCat?func=search&query=sysid:14305790 AB - Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing. ER -