TY - BOOK ID - 14305021 TI - RF and microwave microelectronics packaging AU - Cahill, Sean S. AU - Kim, Franklin. AU - Kuang, Ken. PY - 2010 SN - 1441909834 9786612837876 1441909842 1282837877 1489983244 PB - New York ; London : Springer, DB - UniCat KW - Microelectronic packaging. KW - Microelectronic packaging KW - Electrical & Computer Engineering KW - Electrical Engineering KW - Engineering & Applied Sciences KW - Electronic packaging. KW - Packaging (Electronics) KW - Packaging (Microelectronics) KW - Engineering. KW - Microwaves. KW - Optical engineering. KW - Electronics. KW - Microelectronics. KW - Electronic circuits. KW - Electronics and Microelectronics, Instrumentation. KW - Microwaves, RF and Optical Engineering. KW - Circuits and Systems. KW - Electronic apparatus and appliances KW - Electronics KW - Electronic packaging KW - Microelectronics KW - Systems engineering. KW - Engineering systems KW - System engineering KW - Engineering KW - Industrial engineering KW - System analysis KW - Hertzian waves KW - Electric waves KW - Electromagnetic waves KW - Geomagnetic micropulsations KW - Radio waves KW - Shortwave radio KW - Electrical engineering KW - Physical sciences KW - Design and construction KW - Electron-tube circuits KW - Electric circuits KW - Electron tubes KW - Mechanical engineering KW - Microminiature electronic equipment KW - Microminiaturization (Electronics) KW - Microtechnology KW - Semiconductors KW - Miniature electronic equipment UR - https://www.unicat.be/uniCat?func=search&query=sysid:14305021 AB - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. ER -