TY - BOOK ID - 136866067 TI - Plasma etching processes for interconnect realization in VLSI PY - 2015 PB - London, [England] ; Oxford, [England] : ISTE Press : Elsevier, DB - UniCat KW - Integrated circuits KW - Plasma etching. KW - Molded interconnect devices. KW - Very large scale integration. UR - https://www.unicat.be/uniCat?func=search&query=sysid:136866067 AB - This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. ER -