TY - BOOK ID - 136205809 TI - Frontiers in Ultra-Precision Machining AU - Guo, Jiang AU - Wang, Chunjin AU - Kang, Chengwei PY - 2022 PB - Basel MDPI - Multidisciplinary Digital Publishing Institute DB - UniCat KW - fused silica KW - small-scale damage KW - magnetorheological removing method KW - combined repairing process KW - evolution law KW - diamond grinding KW - single crystal silicon KW - subsurface damage KW - crystal orientation KW - spherical shell KW - thin-walled part KW - wall-thickness KW - benchmark coincidence KW - data processing KW - ultra-precision machining KW - computer-controlled optical surfacing KW - dwell time algorithm KW - removal function KW - elementary approximation KW - atmospheric pressure plasma jet KW - continuous phase plate KW - surface topography KW - high accuracy and efficiency KW - polar microstructures KW - optimization KW - machining parameters KW - cutting strategy KW - flexible grinding KW - shear thickening fluid KW - cluster effect KW - high-shear low-pressure KW - aluminum KW - ion beam sputtering KW - morphology evolution KW - molecular dynamics KW - electrochemical discharge machining (ECDM) KW - material removal rate (MRR) KW - electrode wear ratio (EWR) KW - overcut (OC) KW - electrical properties KW - tool material KW - diamond tool KW - single-point diamond turning KW - lubricant KW - ferrous metal KW - electrorheological polishing KW - polishing tool KW - roughness KW - integrated electrode KW - Nano-ZrO2 ceramics KW - ultra-precision grinding KW - surface residual material KW - surface quality KW - three-dimensional surface roughness KW - reversal method KW - eccentricity KW - piezoelectric actuator KW - flange KW - dynamic modeling KW - surface characterization KW - cutting forces KW - tool servo diamond cutting KW - data-dependent systems KW - surface topography variation KW - microstructured surfaces KW - microlens array KW - three-dimensional elliptical vibration cutting KW - piezoelectric hysteresis KW - Bouc–Wen model KW - flower pollination algorithm KW - dynamic switching probability strategy KW - parameter identification KW - atom probe tomography (APT) KW - single-wedge KW - lift-out KW - focused ion beam (FIB) KW - Al/Ni multilayers KW - vibration-assisted electrochemical machining (ECM) KW - blisk KW - narrow channel KW - high aspect ratio KW - multi-physics coupling simulation KW - machining stability KW - n/a KW - Bouc-Wen model UR - https://www.unicat.be/uniCat?func=search&query=sysid:136205809 AB - Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies. ER -