TY - BOOK ID - 107411046 TI - Modeling of Adhesively Bonded Joints AU - da Silva, Lucas Filipe Martins AU - Öchsner, Andreas AU - SpringerLink (Online service) PY - 2008 SN - 9783540790563 PB - Berlin Heidelberg Springer Berlin Heidelberg DB - UniCat KW - Fluid mechanics KW - Materials sciences KW - Engineering sciences. Technology KW - materiaalkennis KW - ingenieurswetenschappen KW - mechanica UR - https://www.unicat.be/uniCat?func=search&query=sysid:107411046 AB - A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique. ER -