TY - BOOK ID - 103613933 TI - 3D interconnect architectures for heterogeneous technologies : modeling and optimization PY - 2022 SN - 3030982289 3030982297 PB - Cham, Switzerland : Springer, DB - UniCat KW - Interconnects (Integrated circuit technology) KW - Systems on a chip. KW - Three-dimensional integrated circuits. KW - SOC design KW - Systems on chip KW - Embedded computer systems KW - Integrated circuits KW - Interconnections (Integrated circuit technology) KW - 3D ICs (Three-dimensional integrated circuits) KW - Connections UR - https://www.unicat.be/uniCat?func=search&query=sysid:103613933 AB - ER -