TY - BOOK ID - 103612268 TI - TSV 3D RF integration : high resistivity Si interposer technology AU - Ma, Shenglin AU - Jin, Yufeng PY - 2022 SN - 0323996027 0323996035 9780323996037 9780323996020 PB - Amsterdam, Netherlands : Elsevier, DB - UniCat KW - Radio frequency integrated circuits. KW - Three-dimensional integrated circuits KW - Materials. KW - RFICs (Integrated circuits) KW - Integrated circuits KW - Radio circuits KW - 3D ICs (Three-dimensional integrated circuits) KW - Silicon KW - Electric properties. UR - https://www.unicat.be/uniCat?func=search&query=sysid:103612268 AB - TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. ER -