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Book
Integrated Circuits and Systems for Smart Sensory Applications
Authors: --- ---
Year: 2022 Publisher: Basel MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware.


Book
MEMS Packaging Technologies and 3D Integration
Author:
Year: 2022 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

Keywords

heterogeneous integration --- wafer bonding --- wafer sealing --- room-temperature bonding --- Au-Au bonding --- surface activated bonding --- Au film thickness --- surface roughness --- microelectromechanical systems (MEMS) packaging --- inkjet printing --- redistribution layers --- capacitive micromachined ultrasound transducers (CMUT) --- fan-out wafer-level packaging (FOWLP) --- adhesion --- thin film metal --- parylene --- neural probe --- scotch tape test --- FEM --- MEMS resonator --- temperature coefficient --- thermal stress --- millimeter-wave --- redundant TSV --- equivalent circuit model --- S-parameters extraction --- technology evaluation --- MEMS and IC integration --- MCDM --- fuzzy AHP --- fuzzy VIKOR --- fan-out wafer-level package --- finite element --- glass substrate --- reliability life --- packaging-on-packaging --- thermal sensors --- TMOS sensor --- finite difference time domain --- optical and electromagnetics simulations --- finite element analysis --- ultrasonic bonding --- metal direct bonding --- microsystem integration --- biocompatible packaging --- implantable --- reliability --- Finite element method (FEM) --- simulation --- multilayer reactive bonding --- integrated nanostructure-multilayer reactive system --- spontaneous self-ignition --- self-propagating exothermic reaction --- Pd/Al reactive multilayer system --- Ni/Al reactive multilayer system --- low-temperature MEMS packaging --- crack propagation --- microbump --- deflection angle --- stress intensity factor (SIF) --- polymer packaging --- neural interface --- chronic implantation --- n/a


Book
Selected Problems in Fluid Flow and Heat Transfer
Author:
ISBN: 3039214284 3039214276 Year: 2019 Publisher: MDPI - Multidisciplinary Digital Publishing Institute

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Abstract

Fluid flow and heat transfer processes play an important role in many areas of science and engineering, from the planetary scale (e.g., influencing weather and climate) to the microscopic scales of enhancing heat transfer by the use of nanofluids; understood in the broadest possible sense, they also underpin the performance of many energy systems. This topical Special Issue of Energies is dedicated to the recent advances in this very broad field. This book will be of interest to readers not only in the fields of mechanical, aerospace, chemical, process and petroleum, energy, earth, civil ,and flow instrumentation engineering but, equally, biological and medical sciences, as well as physics and mathematics; that is, anywhere that “fluid flow and heat transfer” phenomena may play an important role or be a subject of worthy research pursuits.

Keywords

n/a --- thermal performance --- microbubble pump --- particle deposition --- flow oscillation --- orthogonal jet --- flat plate --- gas turbine engine --- air heater --- flow behavior --- transonic compressor --- friction factor --- nonlinear thermal radiation --- oscillators --- porous cavity --- POD --- turbulent flow --- thermosyphon --- turbulence --- mass transfer --- tip leakage flow --- capture efficiency --- pipe flow --- correlation --- decomposition dimensionalities --- heat transfer --- pressure loss --- CANDU-6 --- numerical modeling --- CFD --- magnetic field --- boundary layer --- two-phase flow --- heat transfer performance --- Colebrook-White --- computational burden --- phase change --- surrogate model --- Padé polynomials --- traveling-wave heat engine --- flow regime --- numerical simulation --- energetics --- ( A g ? F e 3 O 4 / H 2 O ) hybrid nanofluid --- pumps --- BEM --- SPIV --- acoustic streaming --- microbubbles --- Aspen® --- push-pull --- Positive Temperature Coefficient (PTC) elements --- iterative procedure --- transient analysis --- spiral fin-tube --- toxic gases --- unsteady heat release rate --- water hammer --- method of moment --- visualization --- superheated steam --- impingement heat transfer enhancement --- X-ray microtomography --- moderator --- wind turbine --- flow rate --- fin-tube --- flue gas --- actuator disc --- temperature distributions --- supercritical LNG --- sharp sections --- moment of inertia --- Colebrook equation --- pump efficiency --- tower --- OpenFOAM --- computational fluid dynamics --- chemical reaction --- pump performance --- logarithms --- numerical results --- downwind --- thermodynamic --- triaxial stress --- flow friction --- energy conversion --- entropy generation --- zigzag type --- inertance-compliance --- section aspect ratios --- laminar separation bubble --- axial piston pumps --- thermogravimetry --- pressure drop --- load resistances --- vortex breakdown --- T-section prism --- flow-induced motion --- centrifugal pump --- load --- vortex identification --- decomposition region --- condensation --- performance characteristics --- pipes --- detached-eddy simulation --- Computational Fluid Dynamics (CFD) simulation --- thermal cracking --- real vehicle experiments --- bubble size --- thermal energy recovery --- hydraulic resistances --- concentration --- tower shadow --- fire-spreading characteristics --- thermoacoustic electricity generator --- bubble generation --- multi-stage --- thermal effect --- ferrofluid --- PHWR --- fluidics --- multiphase flow --- printed circuit heat exchanger --- particle counter --- dew point temperature --- Padé polynomials

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